Open Access

Micro-Transfer printing (µTP) is a promising technique for hetero-integration of III-V materials into Si-based photonic platforms. To enhance the print yield by increasing the adhesion between the III-V material and Si or SiO2 surface, an adhesion promoter like Benzocyclobutene is typically used as interlayer. In this work, we demonstrate µTP of InP based coupons on SiO2 interlayer without any adhesive interlayer and investigate the mechanism of adhesive free bonding. Source coupons are InP-based coupon stacks on a sacrificial layer that is removed by a chemical wet etch with FeCl3. For the target we fabricated amorphous-Si waveguides on 8” wafer encapsulated by a High Density Plasma SiO2 which was planarized by a chemical mechanical polishing procedure. We used O2 plasma to activate both source and target to increase adhesion between coupon and substrate. To get a better understanding of the bonding mechanism we applied several surface characterization methods. Root mean square roughness of InP and SiO2 was measured by atomic force microscopy before and after plasma activation. The step height of the micro-transfer printed source coupon on the target wafer is estimated by optical step profiler. We used Raman peak position mappings of InP to analyze possible strain and contact angle measurements on SiO2, before and after plasma activation to observe a change in the hydrophilicity of the surface. X-ray Photoelectron Spectroscopy analysis was used to characterize the surface energy states of P2p, In3d, O1s for InP source and Si2p, O1s for SiO2 target. Our results demonstrate direct bonding of InP coupons by means of µTP without the need of a strain-compensation layer. In this way, a promising route towards Complementary Metal-Oxide-Semiconductor compatible use of µTP for the hetero-integration of InP is provided.

Heavy wire bonding is one of the most common interconnection technologies in manufacturing of high-power electronics. For industrial applications, the long-term reliability of these connections is crucial. Besides the selection of the wire material and the loop geometry itself, the loop forming process parameters also have an influence on the reliability of the wire bond. In this work, the influence of the backward bond head movement during wire bonding process on the quality of wire bond connections was systematically investigated and qualified by cyclic mechanical lifetime tests, surface roughness measurements of the heel area by laser confocal microscopy and static pull tests. The wire bond loops were fabricated with 300 μm aluminum H11 and H14CR wires with different hardness values. The lifetime at low frequency cycle and high frequency cycle regime was determined by means of two different mechanical cyclic test methods operating at 5 Hz and at 60 kHz respectively. The results have shown, that the surface topology of the heel region caused by the initial plastic deformation during the loop forming process has a significant effect on the wire bond failure due to heel cracking. The number of loading cycles to failure shows an inverse correlation with the degree of surface roughness in a so called wrinkling analysis in the low and high frequency cycle regime. The soft wire exhibits different lifetimes compared to the hard ones depending on the testing conditions, while a significant decrease of the lifetime is observed with >30 % reverse movement during bonding in all cases.

The rise of Fe magnetic moment, changes in Al electronic structure and a variation of Al magnetic polarization in thin films of transition metal aluminide Fe60Al40 have been probed through the order-disorder phase transition by soft X-ray absorption spectroscopy and X-ray resonant magnetic reflectivity in the extreme ultraviolet regime. In a course of the transition induced by 20 keV Ne+ irradiation with low fluences (1014 ions·cm-2), X-ray magnetic circular dichroism spectra taken at the Fe L2,3 absorption edges at room and low temperatures revealed a pronounced increase of Fe 3d states spin-polarization. X-ray resonant magnetic reflectivity applied to the Al L2,3 and Fe M2,3 edges allowed to detect the magnetic polarization of Al atoms in the films. The changes in Al electronic structure have been seen by alteration of Al K edge X-ray absorption near edge structure. A difference in anisotropy fields for films before and after irradiation has been observed by element-specific hysteresis loops recorded at low temperatures in absorption and reflection geometries at the Fe L2,3 and M2,3 edges, respectively. An attempt to reduce the top oxide layer by an inductively coupled hydrogen plasma has shown a possibility to recover the chemically ordered phase.

Optical fibers in metrology, telecommunications, sensors, manufacturing, and health science have gained massive research interest. The number of applications is increasing at a fast pace. This book aims to present a collection of recent advances in fiber optics, addressing both fundamental and industrial applications. It covers the current progress and latest breakthroughs in emergent applications of fiber optics. The book includes five chapters on recent developments in optical fiber communications and fiber sensors, as well as the design, simulation, and fabrication of novel fiber concepts.

Optical and microwave waveguides have attracted much research interest in both science and industry. The number of potential applications for their use is growing rapidly. This book examines recent advances in the broad field of waveguide technology. It covers current progress and latest breakthroughs in emergent applications in photonics and microwave engineering. The book includes ten contributions on recent developments in waveguide technologies including theory, simulation, and fabrication of novel waveguide concepts as well as reviews on recent advances.