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- band-pass filter (3)
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Organic film deposition in vacuum is fast developing scientific and industrial domain. We developed installation for deposition of organic films equipped with optical spectrometer for measurements in situ. We are developing new dyes aimed for application in waveguide sensor, nonlinear optics and studying film organisation during deposition. Fluorinated azo-dyes and azomethine dyes were synthesized at University of Applied Sciences Wildau and at the Institute of Organic Chemistry, Kyiv. Compounds were evaporated at a pressure of 10-3 Pa using resistive heated crucible. Glass and glass covered with polytetrafluoroethylene (PTFE) film are used as substrates. The films were studied with Polytec and StellarNet spectrometers and an atomic force microscope. Optical spectra of the dye films revealed, that some compounds were decomposed during evaporation. Several kinds of dyes were evaporated and deposited without decomposition. Some deposited films formed H-aggregates and other types of aggregates. AFM images of dye films showed that their morphology depends on the chemical structure of the compounds and on the nature of the substrate on which the film was grown.
Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to 10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.
Development of tuneable Fabry-Pérot sensors for parallelised photoacoustic signal acquisition
(2019)
Fabry-Pérot (FP) sensors have enabled high resolution 3D photoacoustic (PA) imaging in backward mode. However, raster-scanning of the interrogation laser beam across the sensor can result in slow 3D image acquisition. To overcome this limitation, parallelized PA signal acquisition can be used for which FP sensors with uniform optical thickness are required. In this work, the optical thickness is tuned a) irreversibly through the use of a photopolymer host matrix and b) actively using embedded electro-optic (EO) chromophores. Polymer spacers (5 μm) were deposited using spin coating and sandwiched between two dielectric mirrors and transparent ITO electrodes. The employed polymer guest-host system consists of an EO chromophore (2-methyl-4-nitroaniline) and poly(vinyl cinnamate). EO tuneability was induced using contact poling and a tuneability of 68 pm was demonstrated. The optical thickness was homogenised by raster scanning a UV beam whilst varying the exposure time across a 4 mm2 detection aperture.
Tomographic photoacoustic (PA) images acquired using a Fabry-Perot (FP) based scanner offer high resolution and image fidelity but can result in long acquisition times due to the need for raster scanning. To reduce the acquisition times, a parallelised camera-based PA signal detection scheme is developed. The scheme is based on using a sCMOScamera and FPI sensors with high homogeneity of optical thickness. PA signals were acquired using the camera-based setup and the signal to noise ratio (SNR) was measured. A comparison of the SNR of PA signal detected using 1) a photodiode in a conventional raster scanning detection scheme and 2) a sCMOS camera in parallelised detection scheme is made. The results show that the parallelised interrogation scheme has the potential to provide high speed PA imaging.
This work presents experimental and simulation results of a 3D measurement concept based on fiber-optic interference pattern generation. A demonstrator system which is able to adjust different optical and mechanical parameters is described. The results of parameter variation studies are discussed along with possible applications in the field of micro-optical 3D measurement systems like endoscopes. The experiments were prepared with different structures with various scattering properties. To implement that approach into a micro-optical 3D measurement system, the combination of distance variation between the fibers and a controlled phase shift introduced by a retarder can be used to design the system versatile.
We have developed thin film Fabry-Perot filters directly coated on optical fibers to archive a high level of integration with a reduction of optical elements. Such band-pass filters can be used in fiber optical sensor systems, and for fiber communication, e.g. CWDM applications. The filters cavities consist of a single spacer and two dielectric mirrors. The dielectric mirrors are deposited by PVD directly on end-faces of single-mode optical fibers. Dielectric as well as polymeric materials were applied as the spacer layer. Polymeric spacer layers were deposited by dip coating. The influence of the mirror reflectivity on the transmission band of the Fabry-Perot filters was investigated. Furthermore, the optical performance of filters with first order (λ/2) as well as higher order spacers was analyzed. The experimental results are compared with numerical analysis of Fabry-Perot cavities on the end-face of cylindrical waveguides. The spectral characteristic of the filters are calculated using a software solving Maxwell´s equations by a FDTD method. The layer design of the filters and the deposition process were optimized for maximum transmission and narrow bandwidth of the transmission peak. Passive band-pass filters on fiber end-faces were designed, fabricated and characterized for transmission wavelengths of 945 nm, 1300 nm, as well as 1550 nm. Bandwidths as narrow as 1 nm could be achieved for 945 nm.
To improve the feasibility of endoscopic inspection processes we developed a system that provides online information about position, orientation and viewing direction of endoscopes, to support the analysis of endoscopic images and to ease the operational handling of the equipment. The setup is based on an industrial endoscope consisting of a camera, various MEMS and multimodal data fusion. The software contains algorithms for feature and geometric structure recognition as well as Kalman filters. To track the distal end of the endoscope and to generate 3D point cloud data in real time the optical and photometrical characteristics of the system are registered and the movement of the endoscope is reconstructed by using image processing techniques.
In this work, a measurement concept based on triangulation was developed for borescopic 3D-surveying of surface defects. The integration of such measurement system into a borescope environment requires excellent space utilization. The triangulation angle, the projected pattern, the numerical apertures of the optical system, and the viewing angle were calculated using partial coherence imaging and geometric optical raytracing methods. Additionally, optical aberrations and defocus were considered by the integration of Zernike polynomial coefficients. The measurement system is able to measure objects with a size of 50 μm in all dimensions with an accuracy of ± 5 μm. To manage the issue of a low depth of field while using an optical high resolution system, a wavelength dependent aperture was integrated. Thereby, we are able to control depth of field and resolution of the optical system and can use the borescope in measurement mode with high resolution and low depth of field or in inspection mode with low resolution and higher depth of field. First measurements of a demonstrator system are in good agreement with our simulations.
Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a high etch rate at a high aspect ratio, whereby scallops on the sidewalls are generated. In this work, square via arrays with dimensions from 3 to 50 μm and up to 300 μm depth were fabricated and analyzed by spectroscopic reflectometry. The reflectometric data are compared to simulations by a novel theoretical approach. In order to simulate the reflectance spectra of TSV arrays, a combination of 2D and 3D rigorous coupled wave analysis was applied. Besides the via depth, the sidewall angle and the corner radius of the bottom profile were considered in the model. The general requirements on spectral resolution in TSV metrology are discussed.
Integrated photonic devices have gained increasing research interests. Especially silicon photonics have become very attractive for various optical applications. Using silicon-on-insulator as a material platform provides the ability to fabricate photonic devices with electronic devices on a single chip. Driven by substantial research investments, the integration of photonic devices on silicon-on-insulator substrates has reached a degree of maturity that already permits industrial adoption. However, silicon has the disadvantage of linear electro-optical effects, and, therefore, advanced modulation formats are difficult to realize when using silicon-based high-speed modulators. Hence, a new approach was proposed: the silicon-organic hybrid technology. This technology is a viable extension of the silicon-on-insulator material system for efficient high-speed modulation. We herewith present our theoretical and experimental investigations of the silicon-organic hybrid slot-waveguide ring resonator. The advanced device design is described in detail, which allows using both, the efficient silicon-on-insulator strip-waveguides and the silicon-organic hybrid slot-waveguides in single ring resonator. For the first time, we report the transmission spectra of such a resonator covered with an electro-optical polymer.