621 Angewandte Physik
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- 3D sensor (1)
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Laboratory plasmas inherently exhibit temperature and density gradients leading to complex investigations. We show that plasmas generated by laser ablation can constitute a robust exception to this. Supported by emission features not observed with other sources, we achieve plasmas of various compositions which are both uniform and in local thermodynamic equilibrium. These properties characterize an ideal radiation source opening multiple perspectives in plasma spectroscopy. The finding also constitutes a breakthrough in the analytical field as fast analyses of complex materials become possible.
Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to 10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.
An innovative concept of a low-cost pH optode with working volumes of less than 150 µL is presented. The pH monitoring is based on the color changing effect of pH indicators. The optode includes an RGB color sensor patch TCS34725 from Adafruit, a controllable LED and reactor slides and is addressed by a self-written LabVIEW© software. Utilizing the hue value of the HSV color model, it is possible to analyze the color change of the indicator and estimate the pH value of the analyzed samples by exploiting sigmoidal fit models. Measurements carried out with phenol red and DMEM (Dulbecco's Modified Eagle's Medium) reported a standard error of calibration in the physiologic pH range (6.5–7.5) of ±0.04 pH units.
Helium implanted tungsten-titanium ODS alloys are investigated using positron annihilation spectroscopy and nanoindentation. Titanium reduces the brittleness of the tungsten alloy, which is manufactured by mechanical alloying. The addition of Y2O3 nanoparticles increases the mechanical properties at elevated temperature and enhances irradiation resistance. Helium ion implantation was applied to simulate irradiation effects on these materials. The irradiation was performed using a 500 kV He ion implanter at fluences around 5 × 1015 cm−2 for a series of samples both at room temperature and at 600 °C. The microstructure and mechanical properties of the pristine and irradiated W-Ti-ODS alloy are compared with respect to the titanium and Y2O3 content. Radiation damage is studied by positron annihilation spectroscopy analyzing the lifetime and the Doppler broadening. Three types of helium-vacancy defects were detected after helium irradiation in the W-Ti-ODS alloy: small defects with high helium-to-vacancy ratio (low S parameter) for room temperature irradiation, larger open volume defects with low helium-to-vacancy ratio (high S parameter) at the surface and He-vacancy complexes pinned at nanoparticles deeper in the material for implantation at 600 °C. Defect induced hardness was studied by nanoindentation. A drastic hardness increase is observed after He ion irradiation both for room temperature and elevated irradiation temperature of 600 °C. The Ti alloyed tungsten-ODS is more affected by the hardness increase after irradiation compared to the pure W-ODS alloy.
Structured light has become a widespread technique for the development of camera-based 3D sensors. The structured illumination provides texture to homogeneous objects and thus allows for the reliable determination of the disparity of each object point in a stereo-camera setting. Even a monocular 3D sensor is possible if the light projector has a fixed relative position to the camera and if the structured light is coded, i.e. the position within the whole light pattern can be reconstructed uniquely from a small local window of the pattern, the uniqueness window. Coded patterns with such a uniqueness property are called Perfect SubMaps (PSM). In our paper we focus on the design and evaluation of the subset of symmetric isolated binary toroidal PSMs (SIBTPSM) for structured light patterns, because of their beneficial properties with respect to the signal-to-noise ratio and the use with laser light sources and DOEs. We define several figures of merit that are relevant for the practical use of PSMs in a 3D sensor: the PSM size, the size of the uniqueness window, the Hamming distance, the density, and the homogeneity. We have created SIBTPSMs using our own dedicated algorithms and have designed and fabricated DOEs that produce these patterns with large fan angles of 61° × 47° when used with near-infrared diode lasers (λ = 830nm). We analyze the influence of these characteristics on the 3D measurement process by theory, simulations, and experiments. The patterns of publicly available DOEs based on SIBTPSMs are used for comparison and reference. Our results show that the PSM width, the uniqueness window size, the minimum and average Hamming distances, and the uniformity have strong impact on either speed or quality of the 3D reconstruction, whereas the point density and the PSM height are of minor importance.
In unserer hochtechnologisierten Gesellschaft spielt die optische Datenübertragung aufgrund der stetig wachsenden Informationsvielfalt eine immer bedeutendere Rolle. In den Anfängen der Nachrichtentechnik waren Datenraten von wenigen bit/s realisierbar. Heute werden mittels optischer Technologien Übertragungsraten von mehreren Gbit/s umgesetzt. Möglich wird dies durch neue Entwicklungen in der Chip-integrierten Photonik. Beispiele dafür sind Chip-integrierte elektrooptische Modulatoren und Schalter. In diesem Artikel werden neue Entwicklungen in der Chip-integrierten Photonik diskutiert und die experimentelle Charakterisierung der Bauelemente in Form eines Ringresonators beschrieben. Für die Experimente wird exemplarisch ein photonisches Bauelement genutzt, das aus einem hybriden Silizium-Polymer-Materialsystem besteht. Die Ergebnisse zeigen, dass diese Materialkombination vielversprechend für zukünftige Chip-integrierte photonische Bauelemente mit extrem geringem Energiebedarf ist.