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Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8” wafer platform

  • Micro-Transfer printing (µTP) is a promising technique for hetero-integration of III-V materials into Si-based photonic platforms. To enhance the print yield by increasing the adhesion between the III-V material and Si or SiO2 surface, an adhesion promoter like Benzocyclobutene is typically used as interlayer. In this work, we demonstrate µTP of InP based coupons on SiO2 interlayer without any adhesive interlayer and investigate the mechanism of adhesive free bonding. Source coupons are InP-based coupon stacks on a sacrificial layer that is removed by a chemical wet etch with FeCl3. For the target we fabricated amorphous-Si waveguides on 8” wafer encapsulated by a High Density Plasma SiO2 which was planarized by a chemical mechanical polishing procedure. We used O2 plasma to activate both source and target to increase adhesion between coupon and substrate. To get a better understanding of the bonding mechanism we applied several surface characterization methods. Root mean square roughness of InP and SiO2 was measured by atomic force microscopy before and after plasma activation. The step height of the micro-transfer printed source coupon on the target wafer is estimated by optical step profiler. We used Raman peak position mappings of InP to analyze possible strain and contact angle measurements on SiO2, before and after plasma activation to observe a change in the hydrophilicity of the surface. X-ray Photoelectron Spectroscopy analysis was used to characterize the surface energy states of P2p, In3d, O1s for InP source and Si2p, O1s for SiO2 target. Our results demonstrate direct bonding of InP coupons by means of µTP without the need of a strain-compensation layer. In this way, a promising route towards Complementary Metal-Oxide-Semiconductor compatible use of µTP for the hetero-integration of InP is provided.

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Metadaten
Author:Ketan AnandORCiD, Patrick SteglichORCiD, Jochen Kreissl, Carlos Alvarado ChavarinORCiD, Davide SpiritoORCiD, Max FranckORCiD, Giulia LecciORCiD, Ioan Costina, Norbert Herfurth, Jens Katzer, Christian Mai, Annette BeckerORCiD, Johann Peter ReithmaierORCiD, Lars ZimmermannORCiD, Andreas MaiORCiD
URN:urn:nbn:de:kobv:526-opus4-19240
DOI (Version of Record):https://doi.org/10.1016/j.tsf.2024.140399
ISSN:0040-6090
Parent Title (English):Thin Solid Films
Publisher:Elsevier
Document Type:Article
Language:English
Year of Publication:2024
Publishing Institution:Technische Hochschule Wildau
Release Date:2024/06/04
Tag:hetero-integration; indium Phosphide; micro-transfer printing; oxygen plasma activation; sacrificial layer; silicon oxide
Issue:140399
Source:Anand, K., Steglich, P., Kreissl, J., Chavarin, C. A., Spirito, D., Franck, M., … Mai, A. (2024). Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8” wafer platform. Thin Solid Films, 799, 140399. doi:10.1016/j.tsf.2024.140399
Faculties an central facilities:Fachbereich Ingenieur- und Naturwissenschaften
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 621 Angewandte Physik
Licence (German):Creative Commons - CC BY - Namensnennung 4.0 International
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