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Adhesive bond quality classification using machine learning algorithms based on ultrasonic pulse-echo immersion data

  • In this study, we explored the detection of weak bonds (WBs) due to contamination and faulty curing (FC) using linear ultrasound and machine learning. For this purpose, aluminium single-lap adhesive joints containing three variants of bonding quality were investigated: perfect bond, WB due to release agent (RA) contamination, and WB due to FC. The data, according to the deviation of the bonding protocol, were arranged in two groups, creating two datasets: distinct and complete. Each dataset included all bonding conditions (perfect, RA, and FC), although the distinct dataset contained only marginal cases, which were expected to be well separable, whereas the complete dataset included data with minor deviations from the bonding protocol. Pulse-echo C-scan images were acquired for all prepared samples in the immersion tank, and 45 features were initially extracted from the time traces representing each bonding group. The initial data were analysed via a t-test and pairwise correlationIn this study, we explored the detection of weak bonds (WBs) due to contamination and faulty curing (FC) using linear ultrasound and machine learning. For this purpose, aluminium single-lap adhesive joints containing three variants of bonding quality were investigated: perfect bond, WB due to release agent (RA) contamination, and WB due to FC. The data, according to the deviation of the bonding protocol, were arranged in two groups, creating two datasets: distinct and complete. Each dataset included all bonding conditions (perfect, RA, and FC), although the distinct dataset contained only marginal cases, which were expected to be well separable, whereas the complete dataset included data with minor deviations from the bonding protocol. Pulse-echo C-scan images were acquired for all prepared samples in the immersion tank, and 45 features were initially extracted from the time traces representing each bonding group. The initial data were analysed via a t-test and pairwise correlation analysis to reveal statistically significant features. Then, we performed dimensionality reduction using tree-based, recursive, sequential, and linear discriminant analysis (LDA) feature selectors to explore feature importance and classification accuracy with different feature subsets. Finally, the important features identified with the different feature selectors were fed to support vector machine (SVM) classifiers, and the classification accuracies were compared amongst the different feature subsets. The classification accuracy using a distinct dataset in some cases demonstrated nearly 99% accuracy, indicating that significant bonding protocol deviations could be easily detected. It was demonstrated that classification accuracy increased with the number of features. However, even in the case of the 2D feature space obtained using linear discriminant analysis, the bonding quality classification accuracy remained higher than 84%. The feature subspace reduction with LDA demonstrated sufficient classification accuracy and an improvement of nearly 40% in training time compared with that for the initial feature set. Thus, the classical ultrasonic pulse-echo C-scan with an LDA feature transformation and SVM classifier could be used to identify the deviations in the bonding protocol in aluminium single-lap adhesive joints.zeige mehrzeige weniger

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Metadaten
Autor*innen:V. SamaitisORCiD, Bengisu YilmazORCiD, E. JasiunieneORCiD
Dokumenttyp:Zeitschriftenartikel
Veröffentlichungsform:Verlagsliteratur
Sprache:Englisch
Titel des übergeordneten Werkes (Englisch):Journal of Sound and Vibration
Jahr der Erstveröffentlichung:2023
Organisationseinheit der BAM:8 Zerstörungsfreie Prüfung
8 Zerstörungsfreie Prüfung / 8.4 Akustische und elektromagnetische Verfahren
Verlag:Journal of Sound and Vibration
Jahrgang/Band:546
Aufsatznummer:117457
Erste Seite:1
Letzte Seite:18
DDC-Klassifikation:Naturwissenschaften und Mathematik / Chemie / Analytische Chemie
Freie Schlagwörter:Adhesive bonding; Defect characterisation; Machine learning; Ultrasonic imaging
Themenfelder/Aktivitätsfelder der BAM:Chemie und Prozesstechnik
DOI:10.1016/j.jsv.2022.117457
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:19.12.2022
Referierte Publikation:Ja
Datum der Eintragung als referierte Publikation:23.01.2023
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