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Commercial LTCC for thin film deposition

  • Low-temperature co-fired ceramics (LTCC) are used to fabricate multilayer circuits which are robust in harsh environments. Thick-film technology is well established for the metallization of circuit boards and microsystems. For specific sensor applications, the combination of LTCC and thin-film technology is advantageous to reach higher structure resolutions. Due to the high roughness of as-fired LTCC surfaces compared with silicon-wafers, the deposition of low-defect- films with narrowly specified properties is challenging. There is spare literature about thin films on commercial LTCC comparing different material systems or sintering techniques. For developing thin film sensors on multilayer circuits it is crucial to identify thin-film-compatible commercial LTCC material as well as the crucial surface properties. In this work we evaluate the thin-film capability of different LTCC surfaces. The as-fired surfaces of free-sintered, constrained-sintered (sacrificial tape), andLow-temperature co-fired ceramics (LTCC) are used to fabricate multilayer circuits which are robust in harsh environments. Thick-film technology is well established for the metallization of circuit boards and microsystems. For specific sensor applications, the combination of LTCC and thin-film technology is advantageous to reach higher structure resolutions. Due to the high roughness of as-fired LTCC surfaces compared with silicon-wafers, the deposition of low-defect- films with narrowly specified properties is challenging. There is spare literature about thin films on commercial LTCC comparing different material systems or sintering techniques. For developing thin film sensors on multilayer circuits it is crucial to identify thin-film-compatible commercial LTCC material as well as the crucial surface properties. In this work we evaluate the thin-film capability of different LTCC surfaces. The as-fired surfaces of free-sintered, constrained-sintered (sacrificial tape), and pressure-assisted sintered commercial LTCCs (DP951, CT708, CT800), as well as respective polished surfaces, were analyzed by tactile and optical roughness measurements and scanning electron microscopy. The thin-film capability of the LTCC surfaces was assessed by sheet resistance and temperature coefficient of resistance (TCR) of deposited Ni thin-film layers. Contrary to the expectations, no correlation between roughness and thin-film capability was found. Ni thin films on constrained sintered DP951 show the lowest sheet resistance and highest TCR within the experimental framework of the as-fired surfaces. The influence of surface morphology on the film properties is discussed.zeige mehrzeige weniger

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Metadaten
Autor*innen:Sophie BreschORCiD
Koautor*innen:Patrick Höhne, Björn Mieller, Ralf Koppert, Torsten Rabe
Dokumenttyp:Vortrag
Veröffentlichungsform:Präsentation
Sprache:Englisch
Jahr der Erstveröffentlichung:2022
Organisationseinheit der BAM:5 Werkstofftechnik
5 Werkstofftechnik / 5.4 Multimateriale Fertigungsprozesse
DDC-Klassifikation:Technik, Medizin, angewandte Wissenschaften / Ingenieurwissenschaften / Ingenieurwissenschaften und zugeordnete Tätigkeiten
Freie Schlagwörter:Hydrogen sensor; LTCC; Roughness
Themenfelder/Aktivitätsfelder der BAM:Energie
Energie / Wasserstoff
Material
Veranstaltung:KERAMIK 2022 / 97. DKG-Jahrestagung
Veranstaltungsort:Online meeting
Beginndatum der Veranstaltung:7.3.2022
Enddatum der Veranstaltung:9.3.2022
Verfügbarkeit des Dokuments:Datei im Netzwerk der BAM verfügbar ("Closed Access")
Datum der Freischaltung:10.03.2022
Referierte Publikation:Nein
Eingeladener Vortrag:Nein
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