620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
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We present inductive power transfer (IPT) with a half-bridge converter based on differential relaxation self-oscillation. The oscillation dynamics of the converter automatically adapts to variation in the inductive coupling link and changes in the load, respectively. Design equations based on theoretical circuit analysis reveals a high power transfer efficiency (>90%) for alteration of coupling distance in the strong coupling regime. A prototype system employing GaN-HEMTs confirms the theoretically predicted characteristics of the proposed circuit.
We present a novel differential relaxation oscillator for inductive power transfer. The proposed oscillator offers an automatic adaption of the oscillation period to a change in the power link impedance, which ensures a high efficient operation for variable loads and coupling factors. A detailed circuit model of the self-oscillation system is provided with analytical design equations. We find a large self-oscillation range for variable coupling factors and loads. The theoretical results are confirmed by circuit simulation and measurements carried out on a low-power demonstrator system. We demonstrate non-resonant and robust self-adaption of the relaxation oscillator to coupling factors ranging from k=0.6-0.9.
A DDR2 SDRAM test setup implemented on the Griffin III ATE test system from HILEVEL Technologies is used to analyse the row hammer bug. Row hammer pattern experiments are compared to standard retention tests.
The analysis confirms that the row hammer effect is caused by a charge excitation process depending on the number of stress activation cycles. The stress has to occur in the local neighborhood of the cells under test.
Shallow impurity levels support the responsible charge carrier transport process in the used DDR2 SDRAM technology
Increasing demand for energy-efficient means of transport has steadily intensified the trend towards lightweight components. Thermoplastic glass fiber composites (organo sheets) play a major role in the production of functional automotive components. Organo sheets are cut, shaped and functionalized by injection molding to produce hybrid components, such as those used in car door modules. The cutting process produces a considerable amount of production waste, which has thus far been thermally recycled. This study develops a closed mechanical recycling process and analyzes the different steps of the process. The offcuts were shredded using two shredding methods and implemented directly in the injection-molding process. Using tensile tests and impact bending tests, the material properties of the recycled materials were compared with the virgin material. In addition, fiber length degradation via the injection-molding process and the influence of the waterjet-cutting process on the mechanical properties are investigated. Recycled offcuts are both comparable to new material in terms of mechanical properties and usability, and are also economically and ecologically advantageous. Recycling polypropylene waste with glass fiber reinforcement in a closed loop is an effective way to reduce industrial waste in a sustainable and economical production process.
The problem dealt with in this paper is the analytical determination of the attitude of a rigid body which undergoes a given rate profile. Usually the attitude is determined by solving the kinematic differential equation numerically. For long lasting movements the outcome can cost computation time plus encountered losses in accuracy, which can be disturbing especially in optimization problems. This contribution solves the kinematic differential equation for certain rate profiles exactly and compares the results in accuracy and computation time with the standard procedures.
Benedigtbeuerer Reinraumtage
(2015)
Applications in engineering frequently require the adjustment of certain parameters. While the mathematical laws that determine these parameters often are well understood, due to time limitations in every day industrial life, it is typically not feasible to derive an explicit computational procedure for adjusting the parameters based on some given measurement data. This paper aims at showing that in such situations, direct optimization offers a very simple approach that can be of great help. More precisely, we present a numerical implementation for the local minimization of a smooth function f:Rn→R subject to upper and lower bounds without relying on the knowledge of the derivative of f. In contrast to other direct optimization approaches the algorithm assumes that the function evaluations are fairly cheap and that the rounding errors associated with the function evaluations are small. As an illustration, this algorithm is applied to approximate the solution of a calibration problem arising from an engineering application. The algorithm uses a Quasi-Newton trust region approach adjusting the trust region radius with a line search. The line search is based on a spline function which minimizes a weighted least squares sum of the jumps in its third derivative. The approximate gradients used in the Quasi-Newton approach are computed by central finite differences. A new randomized basis approach is considered to generate finite difference approximations of the gradient which also allow for a curvature correction of the Hessian in addition to the Quasi-Newton update. These concepts are combined with an active set strategy. The implementation is public domain; numerical experiments indicate that the algorithm is well suitable for the calibration problem of measuring instruments that prompted this research. Further preliminary numerical results suggest that an approximate local minimizer of a smooth non-convex function f depending on n≤300 variables can be computed with a number of iterations that grows moderately with n.
Ein zweistufiger Operationsverstärker wird parallel in einer 180nm CMOS Technologie in der Entwicklungsumgebung von Cadence ADE und in MATLAB/Simulink in einem modellbasierten Ansatz entworfen und simuliert. Für den Entwurf in MATLAB/Simulink wird das Kleinsignalersatzschaltbild der physikalischen Schaltung verwendet. Mit Hilfe der Co-Simulation zwischen Cadence und MATLAB/Simulink wird das Verhalten simuliert und ausgewertet. Die Ergebnisse aus beiden Modellen stimmen überein, wodurch festgestellt werden kann, dass die Co-Simulation erfolgreich war.
One major problem of a continuous process like plastic extrusion is their incapability to deal with non-local gas pressure. This is an inherent problem because a continuous process has an open end in the feeding port where pressure can escape. In this study a novel feeding system was developed to enable granulate feeding into gas pressurized processes inside a single- or twin-screw extruder. With this apparatus gas pressure can be applied inside the extrusion process. The apparatus separates the pressurized extruder from the dosing equipment that feeds the extruder. It keeps the pressure inside the system while continuously feeding new material into the process. A small-scale prototype was designed for proof-of concept. The small size of the prototype was able to handle small amounts of granulates of around 100 - 200 g/h. An applied gas pressure of 8 bar was achieved. In future optimizations, throughput can be increased and maximum applied gas pressure towards 15-20 bar.
Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
Topic coverage includes:
Failure Analysis Process Flow
Failure Verification
Failure Modes and Failure Classification
Special Devices (MEMS, Optoelectronics, Passives)
Fault Localization Techniques: Package Level (NDT)
Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
Deprocessing & Imaging Techniques: Deprocessing
General Imaging Techniques
Local Deprocessing & Imaging
Circuit Edit and Design Modification
Material Analysis Techniques
Reference Information: Important Topics for Semiconductor Devices
Failure Analysis Techniques Roadmap
Failure Analysis Operations and Management
Appendices: Failure Analysis Terms, Definitions, and Acronyms
Industry Standards
Einen Bund eingehen
(2016)