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The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLIT®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production.
The System HAILsens implements a device for Real-Time sensor data processing, running on a Texas Instruments Concerto M3 core. An I2C interface is used for sensor communications. Ethernet with UDP on a custom developed three layered frame organisation of sensor data serves as a link to the main system on board of an aeroplane. For backing up the acquired data, all frames are locally stored on an SD Card. To have the possibility of easily checking the current system status, an LCD module and a push-button provide a minimal user interface.