• search hit 2 of 2
Back to Result List

Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability

  • High-power packages show a characteristic three-dimensional heat flow resulting in large lateral changes in chip and case surface temperature. This paper proposes an unambiguous definition for the R/sub thJC/ junction-to-case thermal resistance as a key parameter of such packages based on a transient measurement technique ensuring high repeatability even at very low R/sub th/ values. The technique is illustrated on thermal transient measurements of high-power MOSFET devices. It is also presented how the same measurement results can be used for die attach quality analysis. Finally, a comparative method is shown for measuring the differences of R/sub th/ values among samples with many times higher resolution compared with a direct R/sub thJC/ measurement.

Export metadata

Additional Services

Share in Twitter Search Google Scholar Statistics
Metadaten
Author:Peter Szabó, Oliver SteffensORCiDGND, Michael Lenz, Gábor Farkas
DOI:https://doi.org/10.1109/TCAPT.2005.859768
ISSN:1521-3331
Parent Title (English):IEEE Transactions on Components and Packaging Technologies
Document Type:Article
Language:English
Year of first Publication:2005
Release Date:2021/09/15
Tag:Cold plates; Electrical resistance measurement; MOSFET circuits; Microassembly; Packaging; Semiconductor device measurement; Surface resistance; Temperature; Thermal conductivity; Thermal resistance
Volume:28
Issue:4
First Page:630
Last Page:636
Konferenzangabe:Therminic 2004 Conference, Sophia Antipolis, France, 2004
Institutes:Fakultät Angewandte Natur- und Kulturwissenschaften
Fakultät Angewandte Natur- und Kulturwissenschaften / Labor Bauphysik
Begutachtungsstatus:peer-reviewed
Publication:Externe Publikationen
research focus:Produktion und Systeme