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PCB Embedding using Single-Switch-Pre-Packages as Modular Building Blocks

  • This paper presents a modular fabrication concept for printed circuit board embedded power semiconductors. The fabrication is done in a two step approach. First, the Single-Switch-Pre-Packages (SSPP) are built using standard embedding processes. Subsequently, full converters are fabricated by embedding of the SSPP as functional inlays into a PCB-power module. For optimal heat spreading, the semiconductor dies are silver sintered on a thick copper substrate. To exploit further the potential of the substrate, heat exchanger structures are chemically etched on it. Dielectric coolant serves as the cooling medium in this case. Laboratory demonstrators are built and characterization is performed as proof-of-concept. Thermal test indicates an junction to ambient thermal resistance of 0.43 K/W, compared to 0.8 K/W for reference module on a standard cold plate with water glycol. The hydraulic power and coolant temperature were identical for both cases.

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Metadaten
Author:Ankit Bhushan Sharma, Johann Schnur, Niko Haag, Vladimir Polezhaev, Till HuesgenORCiD
Identifier:978-3-8007-5225-6 OPAC HS OPAC extern
Parent Title (English):CIPS 2020; 11th International Conference on Integrated Power Electronics Systems
Publisher:VDE
Place of publication:Berlin
Document Type:conference proceeding (article)
Conference:CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, March, 24-26, 2020, Berlin, Germany
Language:English
Year of first Publication:2020
Tag:LILIPUT
Number of pages:6 Seiten
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Polezhaev, Vladimir
Research Project:Liliput – Leiterplattenintegrierter Dreipunktwechselrichter
Publication reviewed:begutachtet
Release Date:2021/01/19
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