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Measurement and calculation of x-ray production efficiencies for copper, zirconium, and tungsten
(2022)
Electron probe microanalysis (EPMA) is based on physical relations between measured X-ray intensities of characteristic lines and their Xray production efficiency, which depends on the specimen composition. The quality of the analysis results relies on how realistically the physical relations describe the generation and emission of X-rays. Special experiments are necessary to measure X-ray production efficiencies. A challenge in these experiments is the determination of the detection efficiency of the spectrometer as a function of the photon energy. An energy-dispersive spectrometer was used in this work, for which the efficiency was determined at metrological synchrotron beamlines with an accuracy of ±2%. X-ray production efficiencies for the L series and the Kα series of copper and zirconium and for the M and L series of tungsten were determined at energies up to 30 keV in a scanning electron microscope. These experimental values were compared with calculated X-ray production efficiencies using physical relations and material constants applied in EPMA. The objective of the comparison is the further improvement of EPMA algorithms as well as extending the available database for X-ray production efficiencies. Experimental data for the X-ray production efficiency are also useful for the assessment of spectrum simulation software.
The present study reports on results of analysis of the elemental composition of thin films by electron probe microanalysis with energy dispersive (ED-EPMA) X-ray spectrometry in conjunction with the dedicated thin-film analysis software package Stratagem and by X-ray fluorescence in its version with a micro-focus X-ray fluorescence (μ-XRF) source attached to a scanning electron microscope (SEM). Two thin-film systems have been analyzed: Fe1-xNix on silicon wafer and Si1-xGex on Al2O3 substrate, in both cases the layers being grown to a thickness of about 200 nm by ion beam sputter deposition. Samples of five different atomic fractions have been produced and analyzed for each thin-film system. Moreover, reference samples with certified elemental composition and thickness have been also available. This study is part of an interlaboratory comparison organized in the frame of standardization technical committee ISO/TC 201 “Surface chemical analysis.” Two laboratories have been analyzed by ED-EPMA (one laboratory standardless and one laboratory using both standardless and with standards variants) and one laboratory by μ-XRF (standardless and with standards). All the elemental compositions obtained with different methods are in very good agreement for the complete two sets of five samples each.
The Systematic Review of ISO/DIS 15632 Selected Instrumental Parameters for the Specification and Checking of Energy-Dispersive X-Ray Spectrometers for Use in Electron Probe Microanalysers is discusssed. Zero strobe peak, better description of dead-time and of the pulse-processing electronics are the major issues under discussion.
There are different ways how to prove the quality of the analytical results obtained in a laboratory, e.g. use of validated standard operation procedures, participation in proficiency testing exercises, use of certified reference materials, etc. International standards provide requirements, specifications, Guidelines or characteristics of methods, instruments or samples with the final goal that these can be used consistently in accredited laboratories. In the field of electron microscopy and microbeam analysis standardization and metrology are terms which are encountered rather seldom at major conferences and scientific publications. Nevertheless, spectra formats like EMSA/MSA for spectral-data exchange or tagged image file format (TIFF) for SEM, guidelines for performing quality assurance procedures or for the specification of X-ray spectrometers as well as of certified reference materials (CRMs) in EPMA, or measurement of average grain size by electron backscatter diffraction (EBSD), or guidelines for calibrating image magnification in SEM or TEM are ISO standards already published and used successfully by a large part of the electron microscopy and microbeam analysis community. A main and continuous task of ISO/TC 202 and its subcommittees is to identify and evaluate feasible projects/proposals to be developed into new international standards, particularly with respect to recent but established technology, such the silicon drift detector (SDD) EDS.
An international platform in the frame of which pre-standardization work can be organized is VAMAS (Versailles Project on Advanced Materials and Standards). International collaborative projects involving aim at providing the technical basis for harmonized measurements, testing, specifications, and standards to be further developed at ISO level. One key point of VAMAS activities is constituted by inter-laboratory comparisons for high-quality data. In the field of microbeam analysis, the technical working area (TWA) 37 Quantitative Microstructural Analysis deals with corresponding projects. Good ideas, e.g. on analysis of low-Z materials/elements and at low energies are particularly encouraged by directly contacting the author. Support and already available guidance will be supplied.