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DICONDE (Digital Imaging and Communication in Non-Destructive Testing) is an open international standard for storing and exchanging industrial test data and process-related information. The DICONDE standard defines both the semantics for structured storage of data and the network-based communication between two endpoints. This allows many test processes to be mapped digitally and securely, while at the same time meeting normative requirements such as traceability to the tester and test object and reproducibility of test results.
DICONDE in der ZfP
(2023)
DICONDE (Digital Imaging and Communication in Non-Destructive Evaluation) ist ein offener internationaler Standard zur Speicherung und zum Austausch industrieller Prüfdaten und prozessbezogener Informationen. Der DICONDE-Standard definiert sowohl die Semantik für eine strukturierte Speicherung von Daten als auch die netzwerkbasierte Kommunikation zwischen zwei Endpunkten. Damit lassen sich viele Vorgänge von Prüfprozessen digital und sicher abbilden und gleichzeitig normative Anforderungen wie eine Rückführbarkeit zum Prüfer und Prüfobjekt sowie eine Reproduzierbarkeit von Prüfergebnissen erfüllen.
There is no applicable existing standard for the determination of safety characteristics for hybrid mixtures. While developing a new standard in a joint research project in Germany first results from parameter studies led to a standard procedure that can be adopted by laboratories that are already testing dusts in the so called 20L-sphere with as little additional effort as necessary. In fact, one of the main objectives of this research project was to keep modifications and adjustments from the generally accepted dust testing procedures as easy and minimal as possible so as to limit potential deviations from one laboratory to another.
In this first round robin test on hybrid mixtures ever, with methane as gas component and a specific corn starch as dust sample, the practicality of the whole procedure, the scattering of the results and the deviation between the testing apparatuses is investigated. This paper summarizes the experimental procedure adopted and objectives of the first round-robin phase involving three of the four original German companies, plus volunteering laboratories from Australia, Belgium, Czech Republic, France, Poland and P.R. China. The results will have an impact on the new standard and may lead to robust data for later simulation purposes.
Aluminium is still one of the most important contact metallisations for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting dedicated test specimens to standardised stress tests as e.g. active or passive thermal cycling. This paper proposes a novel method for accelerated stress testing and lifetime modelling of thin aluminium films in the high-cycle fatigue regime by isothermal mechanical loading. The proposed novel test method is suggested to complement or replace resource-demanding thermal cycling tests and allow simple in-situ monitoring of failure.