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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics

  • This work investigates a packaging solution for high voltage semiconductors (20 kV), allowing for a dramatic reduction in size and complexity of power electronics modules. The standard packaging structures typically introduce a competition between electrical insulation (which requires thick insulating layers) and thermal performance (where thin, high thermal conductivity layers are preferred). Here, we introduce a concept which addresses this competition and is based on direct cooling using dielectric liquid. Single-chip heatsinks are designed, optimized using computational fluid dynamics (CFD), built and tested.

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Metadaten
Author:Amin Salim Obaid Al-Hinaai, Till HuesgenORCiD, Cyril Buttay, Eric Vagnon, Richard Zeitler, Daniela Meyer
DOI:https://doi.org/10.1109/IWIPP50752.2022.9894055
Identifier:978-1-7281-9933-7 OPAC HS OPAC extern
Identifier:978-1-7281-9295-6 OPAC HS OPAC extern
Parent Title (English):2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Publisher:IEEE
Place of publication:Piscataway
Document Type:conference proceeding (article)
Conference:2022 IEEE International Workshop on Integrated Power Packaging (IWIPP), 24-26 August 2022, Grenoble, France
Language:English
Date of Publication (online):2022/08/29
Year of first Publication:2022
Tag:ARCHIVE
Article Number:22112980
Number of pages:6 Seiten
First Page:1
Last Page:6
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 60 Technik
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Al-Hinaai, Amin
Research Project:ARCHIVE – ARchitecture Ceramic for HIgh Voltage power Electronics
Publication reviewed:begutachtet
Release Date:2022/11/10
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