MetadatenAuthor: | Amin Salim Obaid Al-Hinaai, Till HuesgenORCiD, Cyril Buttay, Eric Vagnon, Richard Zeitler, Daniela Meyer |
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DOI: | https://doi.org/10.1109/IWIPP50752.2022.9894055 |
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Identifier: | 978-1-7281-9933-7 OPAC HS OPAC extern |
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Identifier: | 978-1-7281-9295-6 OPAC HS OPAC extern |
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Parent Title (English): | 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) |
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Publisher: | IEEE |
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Place of publication: | Piscataway |
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Document Type: | conference proceeding (article) |
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Conference: | 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP), 24-26 August 2022, Grenoble, France |
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Language: | English |
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Date of Publication (online): | 2022/08/29 |
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Year of first Publication: | 2022 |
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Tag: | ARCHIVE |
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Article Number: | 22112980 |
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Number of pages: | 6 Seiten |
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First Page: | 1 |
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Last Page: | 6 |
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Institutes: | Fakultät Elektrotechnik |
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Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 60 Technik |
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Research focus: | FSP1: Energie |
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| FSP3: Produktion |
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Publication Lists: | Huesgen, Till |
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| Al-Hinaai, Amin |
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Research Project: | ARCHIVE – ARchitecture Ceramic for HIgh Voltage power Electronics |
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Publication reviewed: | begutachtet |
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Release Date: | 2022/11/10 |
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