Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations
Author: | Alexander Hensel, Christian Schwarzer, Matthias Scheetz, Michael Kaloudis, Jörg Franke |
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DOI: | https://doi.org/10.1109/EPTC.2018.8654421 |
Parent Title (English): | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) |
Place of publication: | Singapore |
Document Type: | Conference Proceeding |
Language: | English |
Year of Completion: | 2018 |
Date of first Publication: | 2018/12/07 |
Contributing Corporation: | IEEE |
Release Date: | 2019/12/04 |
GND Keyword: | Leistungselektronik; Hochtemperatur; Sintern |
Volume: | 2018 |
First Page: | 416 |
Last Page: | 421 |
Urheberrecht: | 1 |
research focus : | Intelligent Systems / Electronics and Electric Drives |
Materials / Clean Tech | |
Materials / Material Testing & Sensor Technology | |
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |