Ingenieurwissenschaften und zugeordnete Tätigkeiten
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In this review we present new concepts and recent progress in the application of semiconductur quantum dots (QD) as labels in two important areas of biology, bioimaging and biosensing. We analyze the biologically relevant properties of QDs focusing on the following topics: QD surface treatment and stability labeling of cellular structures and receptors with QDs, incorporation of QDs in living cells, cytotoxicity of QDs and influence of the biolocical environment on the biological and optical properties of QDs. Initially, we consider utilization of QDs as agants in high-resolution bioimaging techniques that can provide information at the molecular levels. The deverse range of modern live-cell QD-based imaging techniques with resolution far beyond the diffraction limit of light is examined. In each technique, we discuss the pros and cons of QD use and deliberate how QDs can be further engineered to facilitate their application in the respective imaging techniques and to produce significant improvements in resolution. Then we review QD-based point-of-care bioassays, bioprobes, and biosensors designed in different formats ranging from analytic biochemistry assays and ELISA, to novel point-of-care smartphone integrated QD-based biotests. Here, a wide range of QD-based fluorescence bioassays with optical transduction, electrochemiluminescence and photoelectrochemical assays are discussedc. Finally, this review provides an analysis of the prospects of application of QDs in selected important Areas of biology.
TMF tests were carried out on EN-GJSA-XNiSiCr35-5-2 at constant minimum temperature (400 °C) and varying maximum temperatures (Tmax = 700 °C, 800 °C, 900 °C) with hold times of 180 s at Tmax and two phase angles (in-phase (IP), 180° out-of-phase (OP)). The results showed a comparable strength under OP- and IP-TMF loading. At Tmax = 700 °C and 900 °C, the lifetime in IP-tests was slightly longer than that of OP-tests, while it is vice versa at Tmax = 800 °C. The IP-tests at Tmax = 900 °C showed a similar lifetime as OP-tests at Tmax = 700 °C and 800 °C, which was unexpected for such a high testing temperature. All IP-tests at Tmax = 900 °C showed a continuous cyclic softening from the beginning on, which was different from all other testing conditions. Complementary metallographic investigations indicated that under this test condition, intergranular creep damage is present in the volume of the test pieces.