Filtern
Dokumenttyp
Sprache
- Englisch (14)
Schlagworte
- Ablation (3)
- Damage (2)
- Femtosecond pulse laser (2)
- Incubation (2)
- Laser ablation (2)
- Laser safety (2)
- Barium aluminium borosilicate glass (1)
- Eye protection (1)
- Femtosecond laser ablation (1)
- Femtosecond pulses (1)
Summary form only given. Machining investigations of crystalline silicon have been performed with laser pulses at a wavelength of 780 nm in the range between 5 fs and 400 fs. Applying 100 pulses per spot, surface damage thresholds were determined by the measurement of the damage diameter. In this pulse duration regime, the threshold fluences were nearly constant. Single-pulse investigations with 5 fs pulses yielded a value of about 0.15 J cm-2 identical to the multi-pulse experiment. This is in contradiction to the behaviour of dielectrics where incubation effects alter the optical properties down to the 5 fs pulse regime. Employing laser pulses with a duration of 130 fs at a wavelength of 800 nm, single-pulse ablation thresholds of 0.23 J cm-2 and 0.16 J cm-2 were determined for Si and InP in air, respectively. The threshold fluence was calculated from the linear relation between the square of the diameters versus the logarithm of the laser fluences.
Zusammenfassung
Laser pulses in the 10-fs domain provide a quality of micromachining of fused silica and borosilicate glass that is unobtainable with longer pulses in the range of several 100 femtoseconds up to picoseconds. The shortening of the pulses reduces the statistical behavior of the material removal and the ablation process thus attains a more deterministic and reproducible character. The improved reproducibility of ablation is accompanied by significantly smoother morphology. This offers the potential for lateral and vertical machining precision of the order of 100 nm and 10 nm, respectively.
Zusammenfassung
The threshold fluences for laser-induced damage of fused silica with single 5-fs pulses from a Ti:sapphire laser system were determined by extrapolating the ablated volume to zero. These thresholds are about 4 times as high as the values previously obtained from multi-shot experiments. This result is interpreted in terms of an irreversible modification of the original material below the single-shot threshold (incubation).
Ablation experiments in several glasses with single and multishot irradiation by laser pulses in the 10-fs pulse duration domain are presented; physical and technological implications are discussed. We demonstrate that these short pulses offer the potential for lateral and vertical machining precision of the order of 100 nm.
Damage experiments of absorbing filters (Schott BG18 and BG36) were performed with Ti:sapphire laser pulses with durations from 30 fs to 340 fs (800 nm, 1 kHz) in air. The direct focusing technique was employed under single- and multi-pulse irradiation conditions. Ablation threshold fluences were determined from a semi-logarithmic plot of the ablation crater diameter vs. laser fluence. The damage threshold fluence decreases for shorter pulse durations. In the investigated pulse duration range, the measured multi-pulse ablation threshold fluences are practically similar to those of undoped glass material (~1 Jcm-2). That means that the multi-pulse ablation threshold is independent on the doping level of the filters. For more than 100 pulses per spot and all pulse durations applied, the threshold fluence saturates. This leads to technically relevant damage threshold values in the femtosecond laser pulse duration domain.
Commercially available absorption filters (Schott BG18 and BG36) were investigated with respect to their single- and
multi-pulse ablation threshold using laser pulses from a Ti:Sapphire laser in the range between 30 and 340 fs. It could be
observed, that the threshold fluence decreases for shorter pulse durations. The similarity of the measured multi-pulse
threshold fluences with those of undoped glass material (around 1 J/cm^2 for a pulse duration of 30 fs) suggests that, for
very short pulses, the threshold is independent on the doping level and therefore, linear absorption does not significantly
contribute to laser-induced damage. For >100 pulses per spot and all pulse durations applied, the threshold fluences
saturate. This independence on the number of applied pulses leads to technically relevant damage threshold values.
Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps
(1997)
Laser-micromachining of barium aluminum borosilicate glass, fused silica and stainless steel has been extended down to a pulse duration of 20 fs generated by a Ti:sapphire laser system at a wavelength of 0.8 micrometer. A systematic study shows that, below 100 fs, an enhanced precision and a substantial decrease of the ablation threshold fluence in comparison to pulse laser processing with pulses in the picosecond and nanosecond range could be achieved. The physical mechanism and the technical relevance of this novel microtechnology is discussed.