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Titanium and its alloys are known to allow the straightforward laser-based manufacturing of ordered surface nanostructures, so-called high spatial frequency laser-induced periodic surface structures (HSFL). These structures exhibit sub-100 nm spatial periods – far below the optical diffraction limit. The resulting surface functionalities are usually enabled by both, topographic and chemical alterations of the nanostructured surfaces. For exploring these effects, multi-method characterizations were performed here for HSFL processed on Ti–6Al–4V alloy upon irradiation with near-infrared ps-laser pulses (1030 nm, ≈1 ps pulse duration, 1–400 kHz) under different laser scan processing conditions, i.e., by systematically varying the pulse repetition frequency and the number of laser irradiation passes. The sample characterization involved morphological and topographical investigations by scanning electron microscopy (SEM), atomic force microscopy (AFM), tactile stylus profilometry, as well as near-surface chemical analyses hard X-ray photoelectron spectroscopy (HAXPES) and depth-profiling time-of-flight secondary ion mass spectrometry (ToF-SIMS). This provides a quantification of the laser ablation depth, the geometrical HSFL characteristics and enables new insights into the depth extent and the nature of the non-ablative laser-induced near-surface oxidation accompanying these nanostructures. This allows to answer the questions how the processing of HSFL can be industrially scaled up, and whether the latter is limited by heat-accumulation effects.
The use of ultrashort laser pulses for material processing in air has many advantages. Due to the progressive development in the laser sector, average powers in the kW range with pulse repetition rates exceeding the MHz-level are available. The machining with high-intensity laser pulses can be accompanied by the generation of a near-surface electron plasma due to absorption and ionization of the material, a subsequent plasma heating by the laser pulse, and finally an interaction of “hot” plasma electrons with the workpiece leading to continuous and characteristic X-ray radiation. The amount of this unwanted X-ray radiation is determined by the laser parameters (pulse duration, intensity, wavelength, polarization), the workpiece (atomic number, surface preparation), and the laser process management (scanning or stationary regime, laser turning). The use of laser intensities above 10^13 W/cm^2 in combination with laser pulse repetition rates in the few 100 kHz-range can lead to X-ray dose rates exceeding the permitted X-ray limits for members of the public. Especially the materials tungsten and steel show significant X-ray emission. Recently, the current state of the art in the field of undesired generation of X-ray radiation during ultrashort pulse laser processing in air was reviewed. In this presentation, important aspects of the measured X-ray doses, X-ray spectra, and practical issues of radiation protection are discussed.
Ultrashort laser pulses have found their way into industrial material processing. They take advantage of the fact that moderate laser fluences can produce high quality material removal without significant thermal influence. The growing availability of powerful, highly repeating laser sources and an advanced laser beam control have favored these developments. However, the laser-matter interaction can be accompanied by the production of X-rays. Small doses per laser pulse can accumulate to significant dose rates at high laser pulse repetition rates which may exceed the permitted X-ray limits for human exposure. Consequently, a proper radiation shielding must be considered in laser material processing. The paper summarizes the current state of the art in the field of undesired generation of X-ray radiation during ultrashort pulse laser material processing in air.
This contribution investigates laser-induced damage of thin film and bulk polymer
samples, with the focus on physical processes occurring close to the damage threshold. In-situ
real-time reflectivity (RTR) measurements with picosecond (ps) and nanosecond (ns) temporal
resolution were performed on thin polymer films on a timescale up to a few microseconds (µs).
A model for polymer thin film damage is presented, indicating that irreversible chemical
modification processes take place already below the fluence threshold for macroscopic damage.
On dye-doped bulk polymer filters (as used for laser goggles), transmission studies using fs-and
ps-laser pulses reveal the optical saturation behavior of the material and its relation to the
threshold of permanent damage. Implications of the sub-threshold processes for laser safety
applications will be discussed for thin film and bulk polymer damage.
Unwanted X-ray emission in ultrashort pulse laser processing: From metallic to biological materials
(2023)
Ultrashort laser pulses have become established in many industrial processes. Additionally, they are also an integral part of medical applications especially in ophthalmology and to some extent in dentistry. The availability of highly repetitive powerful laser sources and advanced laser beam control systems have favored these developments. However, the laser processing may be accompanied by the generation of unwanted X-rays. Small doses per laser pulse can accumulate to significant dose levels at high laser pulse repetition rates. Moreover, burst mode processing increases the X-ray dose rates compared to single pulse use and results in X-ray photon energies up to 40 keV for tungsten targets. For laser treatment of human teeth, clearly noticeable X-ray skin dose rates can be found. The paper summarizes the current state of the art in the field of undesired generation of X-ray radiation during ultrashort pulse laser processing in air.