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Impulse and lock-in thermography have been applied to detect delaminations of prototype solder joints, similar to those to be produced between Cu shunts and Cu busbar stabilisers at the Large Hadron Collider (LHC) at CERN. Two infrared cameras with different detector materials and with different spectral ranges and two excitation techniques have been tested and compared for their ability to detect delaminations behind 2 and 3 mm thick Cu shunts. We have analyzed the signal to noise ratio (SNR) for each detected defect and are able to detect defects down to a nominal edge length of 4 mm behind 2 mm thick Cu shunts by using fast impulse thermography and a camera with a microbolometer array. For the 3 mm thick Cu shunt, on the other hand, the nominal 4 mm defect is only visible in the lock-in thermography phase images and the highest SNR has been achieved with a cooled InSb-based camera. In addition, numerical simulations show the influence of the minimum detectable defect size on the shunt thickness and that the developed on-site testing technique is sufficient to find all defects that are detectable theoretically.
We present an all-purpose crack detection algorithm for flying spot thermography which is directly applicable to a thermogram sequence without the need of any additional information about the experimental setup. A single image containing distinct crack signatures is derived in two steps. Firstly, the spatial derivative is calculated for each frame of the sequence and, secondly, the resulting data set is sorted pixel wise along the time axis. The feasibility of the proposed procedure is proven by testing a piece of rail that comprises roll contact fatigue cracks and by comparing the results with magnetic particle testing.