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Eingeladener Vortrag
- nein (6)
Ceramic components with complex shape cannot be produced frequently by usual ceramic forming and sintering processes. Therefore, numerous joining methods were developed and introduced in industrial scale. Nowadays, multi-stage Mo-Mn-process and active brazing are preferentially used, if temperature-stable and gastight joints are required. Unfortunately, both processes involve cost-intensive thermal processes: hydrogenous atmosphere is essential for metallization in Mo-Mn-process and active brazing takes place under vacuum. Thermal processes can be drastically simplified by using Reactive Air Brazing (RAB). Joining under air atmosphere is an interesting alternative, especially to join oxide ceramic components among themselves. So far, main disadvantage of RAB is low strength of join connections.
Aim of this investigation was the development of high-strength, thermal shock resistant and gastight ceramic-ceramic joints by RAB. Therefore,
- commercial, silver and copper oxide containing RAB soldering composition was modified by addition of ceramic particles with low thermal expansion coefficients (TEC). Hence, thermal misfit between TEC of solder and ceramic components was significantly reduced.
- RAB soldering paste was replaced with newly developed RAB composite tapes, produced by ceramic “doctor blade” technology. Thereby, improved potential exist to tailor the brazing layer relating to composition, thickness and thickness uniformity.
Gastight alumina-alumina, alumina-zirconia and zirconia-zirconia joints with strongly improved strength were produced by novel composite tapes. No strength degradation of joints was observed after thermal cycling up to 700°C.
We have studied the integration of Ni-Cu-Zn ferrite spinels as well as substituted hexagonal Co2Y-and M-type ferrites into LTCC (Low Temperature Ceramic Co-firing) modules. The cofiring behavior and the magnetic properties of these materials were investigated and evaluated for multilayer applications. Ni-Cu-Zn ferrites exhibit permeabilities of µ=300–500 for operating frequencies in the MHz range. Cu-substituted Y-type ferrites Ba2Co2-x-yZnxCuyFe12O22 in combination with sintering additives display sufficient shrinkage and densification at 900°C. A permeability of µ=10 is observed; however, substituted Co2Y-type ferrites do not exhibit long-term stability at 900°C. Co/Ti-substituted M-type ferrites BaFe12-2yCoyTiyO19 (y=1.2) with planar magneto-crystalline anisotropy exhibit excellent soft magnetic behavior. Using sintering additives, complete densification is reached at 900°C and a permeability of µ=15 and a resonance frequency of larger than 1?GHz are observed. Integration of ferrite multilayer inductor components into LTCC modules using free and constrained cofiring technologies is demonstrated.
Integration of magnetic functional components in LTCC Circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of p=900 were developed which can be fully densified at the Standard LTCC sintering temperature of 900 °C. Successful co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal expansion during the cooling period - especially in the temperature range below the transformation point of the glassy phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found by EDX measurements. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, i.e. a decrease of more than 50 %.
To investigate the origin of this permeability reduction, Ni-Cu-Zn ferrite laminates were sintered separately, and in combination with alumina release tapes or dielectric tapes, respectively. SEM and EDX analysis of co-fired laminates reveal differences in the ferrite grain growth behavior. Ferrite laminates with homogeneous microstructure and grain size up to 50 pm exhibit large permeability. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between high permeability and volume fraction of large ferrite grains. Regions of fine and coarse grains inside the ferrite layers show different bismuth concentration; the Bi-content is larger in regions of fine ferrite grains.