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Fracture mechanics-based methods can be applied to the fatigue assessment of mechanical components containing defects or cracks subjected to cyclic loading. The knowledge of the crack growth behavior for short and long cracks enables the determination of both finite and infinite life regimes. Nevertheless, a first problem arises from the empirical determination of the fatigue data, which vary according to the test conditions, e.g., the test method, frequency and the stress ratio R. This is due to crack closure and further environmental phenomena affecting crack propagation behavior. A second issue regards the lack of standard experimental procedures for the determination of the fatigue crack propagation threshold ΔKth dependency on the crack size. This is problematic, since ΔKth increases with the build-up of the closure effects in the short crack regime and its inaccurate experimental determination leads to large deviations in the assessment and, even more critical, to non-conservative predictions. Aiming at providing more reliable and safer assessment procedures, the present work proposes a method based on effective crack growth data obtained at high stress ratios (R ≈ 0.8). A short-crack model based on the cyclic R-curve and CPLR data is employed for describing the development of the closure effects. The predictions are compared to established methods and validated by experimental tests.
The high cooling rates (~106 K/s) occurring during Laser Powder Bed Fusion (PBF-LB/M) of AlSi10Mg induce to the formation of a fine nanometric silicon network in the as-built condition. Such unprecedented microstructure enhances the mechanical strength when compared to equivalent as-cast materials. Nevertheless, PBF-LB/M also leads to high magnitude residual stress (RS) due to the extreme localized temperature gradients. The presence of RS can be detrimental to the fatigue life of engineering components, and great efforts are focused on understanding their generation and evolution after post-process heat treatments. Typically, T6 heat treatments are used to mitigate RS and improve mechanical performances by Mg2Si precipitation during ageing at 160-180°C. Nevertheless, the solutionizing at 500-540°C vanishes the fine silicon network, leading to the formation of micrometric (average of ~2-5 µm) polygonal Si particles, similar to those observed in T6 heat-treated Al-Si cast materials. Therefore, the aim of this work is to evaluate the ability of two so-called low temperature heat treatments (i.e., at 265°C and 300°C) to mitigate RS while retaining the fine as-built microstructure inherent to PBF-LB/M AlSi10Mg. The fatigue behavior of the as-built material is subsequently compared to the two low temperature conditions.