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Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package
(2014)
A highly miniturized piezoresistive humidity sensor has been developed. The starting point of the developement was a 1x1 mm2 piezsoresistive pressure sensor chip. As sensing material, a polyimide was used that swells with increasing adsorption of water molecules. To convert the swelling into an electrical signal, a thin layer of the polimide was deposited onto the bending plate of the pressure sensor. The humidity sensor was characterized in a climate chamber. The measurements show a sensittivity of 0.25 mV per percent relative humidity (%RH) and a non-linearity of 3.1 % full scale (FS) in the range of 30-80%RH. A high cross-sensitivity to temperature of around 0.5 mV°C was measured, so temperature compensation is necessary. For stress-free packaging of the sensor chip, a novel packaging technology was developed.