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In many domains of X-ray spectroscopy, such as materials science, bio-imaging and astronomy, large silicon detectors form the heart of the imaging process. Adequate cooling is a prerequisite for an optimum operation. Dark current can thus be minimized, the effects of radiation damage limited, and reverse annealing and thermal runaway avoided [1], [2].
A so-called active interposer (AI), a narrow 76 x 76 mm² silicon cooling plate with an embedded microchannel network designed for large pn-CCDs, which also takes local heat fields into account, is evaluated by equivalent test structures. Unlike the commonly used massive cooling frames, time spent on cool-down and warm-up may being reduced, miss match in coefficient of thermal expansion (CTE) limited and thermal paths are shortened [3]–[5]. It also serves as a silicon circuit board (SiCB) allowing a dense integration into a tiled-like, large-scale focal plane arrangement with little inactive area.
The equivalent test structure was monitored and supplied with coolant by a high-pressure pump in a vacuum chamber. An analytical as well as a CFD model in ANSYS-Fluent were created to verify, compare, and thoroughly investigate the thermal and hydrodynamic parameters. First tests have shown that temperature gradients below 4°C can be achieved at a power dissipation of 22 watts, with an average temperature increase of 7.5 degrees Celsius at Reynolds numbers below 750. Initial conclusions about the microchannel cooling (MCC) capacity could be drawn and the dependence between temperature gradients and flow rates has been verified.
Last but not least, the experiments have provided first indication that an active interposer and the associated supply system are feasible, paving the way for further steps to increase practicality and functionality in cooling of large semiconductor detectors.