Innovative Material Processing
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We report on laser drilling borehole arrays using ultrashort pulsed lasers with a particular focus on reducing the inadvertent heat accumulation across the workpiece by optimizing the drilling sequence. For the optimization, evolutionary algorithms are used and their results are verified by thermal simulation using Comsol and experimentally evaluated using a thermal imaging camera. To enhance process efficiency in terms of boreholes drilled per second, multi-spot approaches are employed using a spatial light modulator. However, as higher temperatures occur across the workpiece when using simultaneous multi-spot drilling as compared to a single-spot process, a subtle spatial distribution and sequence of the multi-spot approach has to be selected in order to limit the
resulting local heat input over the processing time. Different optimization approaches based on evolutionary algorithms aid to select those drilling sequences which allow for the combination of a high efficiency of multi-spot profiles, a low-generated process temperature and a high-component quality. In particular, using a 4 x 4 laser spot array allows for the drilling of 40,000 boreholes in less than 76 s (526 boreholes/s) with a reduced temperature increase by about 35%, as compared to a single spot process when employing an optimized drilling sequence.
Multi-Bessel Beams Generated by an Axicon and a Spatial Light Modulator for Drilling Applications
(2023)
We report on an optical setup to generate multi-Bessel beam profiles combining a refractive axicon and a spatial light modulator. Based on their particular beam profile, Bessel beams offer advantageous properties for micro drilling processes and internal volume processing, especially for transparent materials. In addition, the laser power of industrial, ultrashort pulsed lasers has increased significantly over the last few years, offering the possibility for highly efficient processes using multi-spot profiles. Our optical concept combines the dynamic possibilities of beam splitting using a spatial light modulator with the benefits of Bessel beams, which facilitates multi-Bessel beam processing. Beside the simulation and experimental evaluation of the generated multi-Bessel beams, we exemplify the applicability of the developed module for the perforation of thin metal foils by micro drilling.
We report on a comprehensive study of the mechanical properties of maraging steel
body-centred cubic lattice structures fabricated by a hybrid additive manufacturing technology that combines laser powder bed fusion with in situ high-speed milling. As the mechanical properties of additive manufactured components are inferior to, e.g., cast components, surface modifications can improve the mechanical behaviour. Different hybrid additive manufacturing technologies have been designed using additive and subtractive processes, improving process quality. Following this, mechanical testing is performed with respect to static tensile properties and dynamic stress, hardness, and porosity, comparing specimens manufactured by laser powder bed fusion only to those manufactured by the hybrid approach. In addition, the influence of different heat-treatment techniques on the mechanical behaviour of the lattice structures is investigated, namely solution and aging treatment as well as hot isostatic pressing. Thus, the influence of the superior surface quality due to the hybrid approach is evaluated, leading to, e.g., an offset of about 14–16% for the static testing of HIP lattice structures. Furthermore, the dynamic load behaviour can be improved with a finished surface, heading to a shift of the different zones of fatigue behaviour in the testing of hybrid-built specimens.
Axicon generated Bessel beams are a popular tool for high aspect ratio precision laser drilling. Spot diameter and working distance are given by the geometric parameters of the axicon and the wavelength used. Thus, it is difficult to manipulate the beam shape of a Bessel beam for a given setup. Spatial light modulators (SLMs) overcome limitations in flexibility. However, due to the limited phase shift of SLMs, only Bessel beams with flat cone angles and large focal length can be generated. In this contribution, an approach for generating Bessel beams with a shorter, but tunable focal length is presented. A physical axicon was combined with an SLM. A holographic image of a negative axicon is put on the SLM to generate a ring beam, which is focused by a subsequent physical axicon to get a small focal diameter. Thus, different sized high aspect ratio micro holes can be drilled without using any moving components.
The creation of aligning layers for the uniform orientation of liquid crystals is significant for both research and the application of liquid crystals. For all applications, the creation of aligning layers possessing controllable characteristics such as azimuthal and polar anchoring energies, easy-axis of director alignment and pretilt angle, in the same way as it is achieved by using photoaligning layers processed by light, is very important. Here, aligning properties of hybrid aligning layers created on the basis of sapphire surfaces additionally coated by photoaligning layer of PVCN-F are studied. These hybrid layers possess the properties of the nano-structured sapphire layer and the photosensitive PVCN-F layer, and complement each other. The irradiation time dependence of the azimuthal anchoring energy of the hybrid layers is studied. By using certain experimental conditions during irradiation of hybrid layers, e.g., polarization of light and irradiation time, a minimum value of the azimuthal anchoring energy, close to zero, was obtained. Atomic force microscope studies of the irradiated hybrid layers were also carried out. It was found that the behavior of the contact angle of nematic droplets placed on treated sapphire surfaces are in good agreement with properties of hybrid aligning layers and parameters of structuring surface obtained from AFM images.
We report on a comprehensive study of laser percussion microvia drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in MHz burst mode. After laser processing, microvia drilling quality is being evaluated by the fabricated diameter and taper using laser scanning microscopy and metallography. The influences of the incubation effect, heat accumulation and shielding effects as a result of pulse to pulse interactions are being discussed on the ablation threshold, penetration depth and laser microvia drilling quality. We find that an increasing heat accumulation in MHz burst mode processing is responsible for the void formation and delamination of the insulating ABF layer. Therefore, the parameter clearance is introduced to evaluate these effects on the microvia sidewalls. For a comparable clearance, applying 2 intra-burst pulses achieves an average reduced taper of down to 19.5% compared to single pulse mode. At the same time, a reduced laser drilling time of 16.7% per microvia highlights the enormous potential of the MHz burst mode for laser drilling of ABF material in printed circuit board fabrication.
This article discusses the process of the laser turning of rotational symmetric, cylindrical components using ultrashort laser pulses with respect to the geometrical conditions and the resulting energy distribution during the laser turning process. As a result, process predictions and potential process optimizations are feasible. Particular attention is drawn to the laser spot formation on the cylindrical surface of the work piece in conjunction with the positioning of the laser beam relative to the rotation axis of the specimen. Based on fundamental calculations and experimental results, an optimum processing strategy is discussed, whereat the use of a trepanning optic in the laser turning process and the forming of a particular surface structure is additionally being issued.
We report on ultraviolet ultrashort pulsed laser processing of silicon carbide. Laser ablated cavities are evaluated with respect to their ablation rates, surface roughness and overall quality by varying the laser pulse fluence. Using this type of laser, high edge quality and surface roughness down to 107 nm can be achieved with an ablation efficiency of up to 0.228 mm 3 W −1 min −1. Functional surfaces are produced by generating laser induced periodic surface structures. The comparison with infrared wavelength underlines the advantages of the ultraviolet wavelength for laser micro machining this material. Significant differences with respect to the measured ablation depths and roughness as well as generated micro-and nanostructures appear. While infrared ablation is dominated by a chipping mechanism above a critical fluence of 9.93 Jcm −2 , higher ablation rates are observed with strong quality losses at the same time. In comparison to the infrared emission wavelength, in general , a significantly higher processing quality is achieved with the ultraviolet emission wavelength. In addition, the influence of spot size and repetition rate in UV processing is investigated. By increasing these parameters, a process acceleration without quality losses is enabled. The generation of a sophisticated microstructure exemplifies the advantages of processing silicon carbide with the UV laser reported here.
We report on the acceleration of femtosecond reductive laser sintering of copper (II) oxide on the surface of transparent cyclic olefin copolymers (COC) by varying the focus size to generate metallic copper (Cu) layers. By using different focusing conditions, different process speeds are achieved, and the structural accuracies are controlled. The formation of Cu lines is observed for different focus sizes at various scan speeds, which is attributed to laser exposure duration and chemical reaction time. The formed lines are categorized and measured by optical microscopy and provide the basis for two-dimensional Cu surfaces. By hatching, high quality conductive films are produced with an increased focus diameter of up to 400 µm at a scan speed of 400 mm/s and a hatch distance of 250 µm resulting in a multiple increased process speed by a factor of thirteen compared to previous research. Using 4-tip measurement , a low sheet resistance of 0.165 Ω/sq was validated on these Cu films, which have an atomic Cu content of 89.5%.
This contribution demonstrates and discusses the preparation of finely dispersed copper(II) oxide nanosuspensions as precursors for reductive laser sintering (RLS). Since the presence of agglomerates interferes with the various RLS sub-processes, fine dispersion is required, and oversized particles must be identified by a measurement methodology. Aside from the established method of scanning electron microscopy for imaging individual dried particles, this work applies the holistic and statistically more significant laser diffraction in combination with dynamic image analysis in wet dispersion. In addition to direct ultrasonic homogenization, high-energy ball milling is introduced for RLS, to produce stable nanosuspensions with a high fine fraction, and, above all, the absence of oversize particles. Whereas ultrasonic dispersion stagnates at particle sizes between 500 nm and 20 μm, even after 8 h, milled suspension contains a high proportion of finest particles with diameters below 100 nm, no agglomerates larger than 1 μm and a trimodal particle size distribution with the median at 50 nm already, after 100 min of milling. The precursor layers produced by doctor blade coating are examined for their quality by laser scanning microscopy. The surface roughness of such a dry film can be reduced from 1.26 μm to 88 nm by milling. Finally, the novel precursor is used for femtosecond RLS, to produce homogeneous, high-quality copper layers with a sheet resistance of 0.28 Ω/sq and a copper mass concentration of 94.2%.