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Optical-resolution photoacoustic microscopy (OR-PAM) combines high spatial resolution and strong absorption-based contrast in tissue, which has enabled structural and spectroscopic imaging of endogenous chromophores, primarily hemoglobin. Conventional piezoelectric ultrasound transducers are typically placed far away from the photoacoustic source due to their opacity, which reduces acoustic sensitivity. Optical ultrasound sensors are an alternative as their transparency allows them to be positioned close to the sample with minimal source-detector distances. In this work, a backward-mode OR-PAM system based on a planar Fabry-Pérot ultrasound sensor and coaxially aligned excitation and interrogation beams was developed. Two 3D imaging modes, using raster-scanning for enhanced image quality and continuous-scanning for fast imaging, were implemented and tested on a leaf skeleton phantom. In fast imaging mode, a scan-rate of 100,000 A-lines/s was achieved. 3D images of a zebrafish embryo were acquired in vivo in raster-scanning mode. The transparency of the FP sensor in the visible and near-infrared wavelength region makes it suitable for combined functional and molecular imaging applications using OR-PAM and multi-photon fluorescence microscopy.
Electro-optical properties of doped polymers with high transparency in the visible wavelength range
(2021)
The electro-optical (EO) properties of poly(methyl methacrylate) and the photopolymer poly(vinyl cinnamate) doped with varying concentrations of the EO chromophore 2-Methyl-4-nitroaniline were measured. The EO polymers were embedded in Fabry-Pérot etalons for the simultaneous determination of the Pockels and Kerr coefficients from measurements of the fringe shift induced by an external electric field. It was found that the host polymer has a significant impact on the EO performance and that the undoped host polymers exhibit a significant Pockels effect. Moreover, the Kerr effect provides a substantial contribution of 27% to the total change of the refractive index at relatively high electric field strengths of E = 91.2 MV m−1.
In unserer hochtechnologisierten Gesellschaft spielt die optische Datenübertragung aufgrund der stetig wachsenden Informationsvielfalt eine immer bedeutendere Rolle. In den Anfängen der Nachrichtentechnik waren Datenraten von wenigen bit/s realisierbar. Heute werden mittels optischer Technologien Übertragungsraten von mehreren Gbit/s umgesetzt. Möglich wird dies durch neue Entwicklungen in der Chip-integrierten Photonik. Beispiele dafür sind Chip-integrierte elektrooptische Modulatoren und Schalter. In diesem Artikel werden neue Entwicklungen in der Chip-integrierten Photonik diskutiert und die experimentelle Charakterisierung der Bauelemente in Form eines Ringresonators beschrieben. Für die Experimente wird exemplarisch ein photonisches Bauelement genutzt, das aus einem hybriden Silizium-Polymer-Materialsystem besteht. Die Ergebnisse zeigen, dass diese Materialkombination vielversprechend für zukünftige Chip-integrierte photonische Bauelemente mit extrem geringem Energiebedarf ist.
Die Modenlinienspektroskopie kann zur hochpräzisen Charakterisierung von Polymerschichten bezüglich des Brechungsindex verwendet werden. Das vorliegende Manuskript behandelt die Theorie der Modenlinienspektroskopie und beginnt dabei mit den theoretischen Grundlagen eines planaren Wellenleiters, die zum Verständnis der Modenlinienspektroskopie notwendig sind. Die hier präsentierten expliziten Herleitungen können genutzt werden, um die Modenlinienspektroskopie so zu modifizieren, dass auch die Messung des Pockelseffektes möglich ist. Eine Anwendungsmöglichkeit soll in der zukünftigen Bestimmung des Pockelskoeffizienten bestehen, der für die Weiterentwicklung von polymerbasierten elektrooptischen Modulatoren benötigt wird. Zudem werden der Aufbau und die experimentelle Herangehensweisen beschrieben und die Brechungsindexbestimmung wird exemplarisch am Beispiel einer Wirt-Gast-Polymerschicht demonstriert.
Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to 10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.
Development of tuneable Fabry-Pérot sensors for parallelised photoacoustic signal acquisition
(2019)
Fabry-Pérot (FP) sensors have enabled high resolution 3D photoacoustic (PA) imaging in backward mode. However, raster-scanning of the interrogation laser beam across the sensor can result in slow 3D image acquisition. To overcome this limitation, parallelized PA signal acquisition can be used for which FP sensors with uniform optical thickness are required. In this work, the optical thickness is tuned a) irreversibly through the use of a photopolymer host matrix and b) actively using embedded electro-optic (EO) chromophores. Polymer spacers (5 μm) were deposited using spin coating and sandwiched between two dielectric mirrors and transparent ITO electrodes. The employed polymer guest-host system consists of an EO chromophore (2-methyl-4-nitroaniline) and poly(vinyl cinnamate). EO tuneability was induced using contact poling and a tuneability of 68 pm was demonstrated. The optical thickness was homogenised by raster scanning a UV beam whilst varying the exposure time across a 4 mm2 detection aperture.
In this study, we present the experimental investigations on interference patterns, such as those already reported in VIMOS-IFU, and up to now no appropriate explanation has been presented. These interference patterns are produced in multimode fibres coated with acrylate or polyimide, which is the preferred coating material for the fibres used in IFUs. Our experiments show that, under specific conditions, cladding modes interact with the coating and produce interference. Our results show that the conditions at which the fibre is held during data acquisition has an impact in the output spectrum. Altering the positioning conditions of the fibre leads to the changes into the interference pattern, therefore, fibres should be carefully manipulated in order to minimise this potential problem and improve the performance of these instruments. Finally we present a simple way of predicting and modelling this interference produced from the visible to the near infrared spectra. This model can be included in the data reduction pipeline in order to remove the interference patterns.
These results should be of interest for the optimisation of the data reduction pipelines of instruments using optical fibres. Considering these results will benefit innovations and developments of high performance fibre systems.
This work presents experimental and simulation results of a 3D measurement concept based on fiber-optic interference pattern generation. A demonstrator system which is able to adjust different optical and mechanical parameters is described. The results of parameter variation studies are discussed along with possible applications in the field of micro-optical 3D measurement systems like endoscopes. The experiments were prepared with different structures with various scattering properties. To implement that approach into a micro-optical 3D measurement system, the combination of distance variation between the fibers and a controlled phase shift introduced by a retarder can be used to design the system versatile.
To improve the feasibility of endoscopic inspection processes we developed a system that provides online information about position, orientation and viewing direction of endoscopes, to support the analysis of endoscopic images and to ease the operational handling of the equipment. The setup is based on an industrial endoscope consisting of a camera, various MEMS and multimodal data fusion. The software contains algorithms for feature and geometric structure recognition as well as Kalman filters. To track the distal end of the endoscope and to generate 3D point cloud data in real time the optical and photometrical characteristics of the system are registered and the movement of the endoscope is reconstructed by using image processing techniques.
In this work, a measurement concept based on triangulation was developed for borescopic 3D-surveying of surface defects. The integration of such measurement system into a borescope environment requires excellent space utilization. The triangulation angle, the projected pattern, the numerical apertures of the optical system, and the viewing angle were calculated using partial coherence imaging and geometric optical raytracing methods. Additionally, optical aberrations and defocus were considered by the integration of Zernike polynomial coefficients. The measurement system is able to measure objects with a size of 50 μm in all dimensions with an accuracy of ± 5 μm. To manage the issue of a low depth of field while using an optical high resolution system, a wavelength dependent aperture was integrated. Thereby, we are able to control depth of field and resolution of the optical system and can use the borescope in measurement mode with high resolution and low depth of field or in inspection mode with low resolution and higher depth of field. First measurements of a demonstrator system are in good agreement with our simulations.