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Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects

  • The scaling limitations of electrical interconnects are driving the demand for efficient optical chip-to-chip links. We report the first monolithic integration of air-clad optical through-silicon waveguides in silicon, fabricated via Bosch and cryogenic deep reactive-ion etching. Rib, single-bridge, and double-bridge designs with 50 μm cores and up to 150 μm propagation lengths have been evaluated. Cryogenic-etched rib waveguides achieve the highest median transmission (66%, −1.80 dB), compared to Bosch-etched ribs (62%, −2.08 dB). Across all geometries, 3 dB alignment windows range from 9.3 μm to 49.2 μm, with Bosch-etched double-bridge waveguides providing the broadest tolerance. We show that geometric fidelity outweighs sidewall roughness for transmission and alignment in these large-core, multimode optical through-silicon waveguides. This technology provides a scalable, complementary metal-oxide semiconductor-compatible pathway toward 3D photonic interconnects.
Metadaten
URN:urn:nbn:de:kobv:526-opus4-20828
Publisher DOI:https://doi.org/10.1109/JSTQE.2025.3615001
Author:Francesco VillasmuntaORCiD, Patrick HeiseORCiD, Manuela Breiter, Sigurd SchraderORCiD, Harald Schenk, Martin RegehlyORCiDGND, Andreas MaiORCiD
Parent Title (English):IEEE Journal of Selected Topics in Quantum Electronics
Document Type:Article
Language:English
Year of Publication:2026
Volume:32
Issue:2
Article Number:3700215
Publisher:IEEE
Faculties an central facilities:Fachbereich Ingenieur- und Naturwissenschaften
Year of first Publication:2025
Publishing Institution:Technische Hochschule Wildau
Tag:coupler; coupling; optical coupling; optical device fabrication; optical interconnection; optical loss; optical surface wave; optical waveguide; silicon; silicon photonics; three-dimensional display; three-dimensional integrated circuit; through-silicon vias (TSV)
Source:Villasmunta, F., Heise, P., Breiter, M., Schrader, S., Schenk, H., Regehly, M., & Mai, A. (2025). Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, 32(2), 3700215. doi:10.1109/JSTQE.2025.3615001
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 621 Angewandte Physik
Licence (German):Creative Commons - CC BY - Namensnennung 4.0 International
Release Date:2025/10/21
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