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Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process

  • Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a high etch rate at a high aspect ratio, whereby scallops on the sidewalls are generated. In this work, square via arrays with dimensions from 3 to 50 μm and up to 300 μm depth were fabricated and analyzed by spectroscopic reflectometry. The reflectometric data are compared to simulations by a novel theoretical approach. In order to simulate the reflectance spectra of TSV arrays, a combination of 2D and 3D rigorous coupled wave analysis was applied. Besides the via depth, the sidewall angle and the corner radius of the bottom profile were considered in the model. The general requirements on spectral resolution in TSV metrology are discussed.

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Author:Joachim Bauer, Oksana Fursenko, Steffen Marschmeyer, Friedhelm Heinrich, Francesco Villasmunta, Claus VillringerORCiD, Christoph Zesch, Sigurd SchraderORCiD
URN:urn:nbn:de:kobv:526-opus4-16093
DOI (Version of Record):https://doi.org/10.1116/1.5120617
Parent Title (English):Journal of Vacuum Science & Technology B
Publisher:American Vacuum Society (AVS)
Document Type:Article
Language:English
Year of Publication:2019
Year of first Publication:2019
Publishing Institution:Technische Hochschule Wildau
Release Date:2022/05/11
Volume:37
Issue:6
Article Number:062205
Source:Joachim Bauer, Oksana Fursenko, Steffen Marschmeyer, Friedhelm Heinrich, Francesco Villasmunta, Claus Villringer, Christoph Zesch, and Sigurd Schrader , "Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process", Journal of Vacuum Science & Technology B 37, 062205 (2019) https://doi.org/10.1116/1.5120617
Copyright:This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in "Joachim Bauer, Oksana Fursenko, Steffen Marschmeyer, Friedhelm Heinrich, Francesco Villasmunta, Claus Villringer, Christoph Zesch, and Sigurd Schrader , "Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process", Journal of Vacuum Science & Technology B 37, 062205 (2019)" and may be found at https://doi.org/10.1116/1.5120617.
Faculties an central facilities:Fachbereich Ingenieur- und Naturwissenschaften
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
Licence (German):Das Dokument ist urheberrechtlich geschützt
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