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100 nm half–pitch double exposure KrF lithography using binary masks

  • In this paper we investigate the process margin for the 100nm half - pitch double exposure KrF lithography using binary masks for different illumination settings. The application of Double Exposure Lithography (DEL) would enlarge the capability of 248 nm exposure technique to smaller pitch e.g. for the integration of dedicated layers into 0.13 μm BiCMOS with critical dimension (CD) requirements exceeding the standard 248 nm lithography specification. The DEL was carried out with a KrF Scanner (Nikon S207D, NALens = 0.82) for a critical dimension (CD) of 100nm half pitch. The chemical amplified positive resists SL4800 or UV2000 (Rohm & Haas) with a thickness of 325nm were coated on a 70 nm AR10L (Rohm & Haas) bottom anti-reflective coating (BARC). With a single exposure and using binary masks it is not possible to resolve 100nm lines with a pitch of 200 nm, due to the refraction and the resolution limit. First we investigated the effect of focus variation. It is shown that the focus difference of 1st and 2nd exposure is one critical parameter of the DEL. This requires a good focus repeatability of the scanner. The depth of focus (DOF) of 360 nm with the coherence parameter σ = 0.4 was achieved for DEL with SL4800 resist. The influence of the better resist resolution of UV2000 on the process window will be shown (DOF = 460 nm). If we change the focus of one of the exposures the CD and DOF performance of spaces is reduced with simultaneous line position changing. Second we investigated the effect of different illumination shapes and settings. The results for conventional illumination with different values for σ and annular illumination with σinner = 0.57 and σouter = 0.85 will be shown. In summary, the results show that DEL has the potential to be a practical lithography enhancement method for device fabrication using high NA KrF tool generation.

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Metadaten
Author:Sebastian Geisler, Joachim Bauer, Ulrich Haak, David Stolarek, K. Schulz, H. Wolf, W. Meier, M. Trojahn, E. Matthus
URN:urn:nbn:de:kobv:526-opus4-15169
DOI (Version of Record):https://doi.org/10.1117/12.771333
Document Type:Conference Proceeding
Language:English
Year of Publication:2008
Publishing Institution:Technische Hochschule Wildau
Release Date:2021/09/16
Tag:Double Exposure Lithography; KrF Lithography; binary masks
First Page:698
Last Page:705
Source:S. Geisler, J. Bauer, U. Haak, D. Stolarek, K. Schulz, H. Wolf, W. Meier, M. Trojahn, and E. Matthus "100 nm half-pitch double exposure KrF lithography using binary masks", Proc. SPIE 6924, Optical Microlithography XXI, 69241Z (11 April 2008); https://doi.org/10.1117/12.771333
Copyright:Copyright 2008 Society of Photo-Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Faculties an central facilities:Fachbereich Ingenieurwesen / Wirtschaftsingenieurwesen (bis 8/2014)
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten
Licence (German):Das Dokument ist urheberrechtlich geschützt
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