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Integration of Memristive Devices into a 130 nm CMOS Baseline Technology

  • The two main features of the memristive devices which makes them the promising candidates for neuromorphic applications are low power consumption and CMOS compatibility. The monolithic integration of memristive devices with CMOS circuitry paves the way for in-memory computing. This chapter focuses on the factors governing the CMOS integration process. Firstly, the influence of CMOS baseline technology selection on the memristor module is briefly discussed. Secondly, the selection of metal level interconnects and their effect on the memristive device performance is explained. Further, the widely used deposition technique for the CMOS compatible memristive switching layers is presented. Finally, the implementation of the optimized process for the fabrication of the memristive module and its influence on the device performance is presented in terms of electrical characterization results.

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Author:Mamathamba Kalishettyhalli MahadevaiahORCiD, Marco LiskerORCiD, Mirko Fraschke, Steffen Marschmeyer, Eduardo Perez, Emilio Perez-Bosch QuesadaORCiD, Christian WengerORCiD, Andreas MaiORCiD
URN:urn:nbn:de:kobv:526-opus4-18029
DOI (Version of Record):https://doi.org/10.1007/978-3-031-36705-2_7
ISBN:978-3-031-36705-2
Parent Title (English):Bio-Inspired Information Pathways: From Neuroscience to Neurotronics
Publisher:Springer International Publishing
Place of publication:Cham
Editor:Martin Ziegler, Thomas Mussenbrock, Hermann Kohlstedt
Document Type:Part of a Book
Language:English
Year of Publication:2024
Publishing Institution:Technische Hochschule Wildau
Release Date:2023/10/02
Tag:CMOS compatibility; CMOS integration; Encapsulation; Memristive devices; Pristine current; Resistive switching; Thermal budget
First Page:177
Last Page:190
Source:Mahadevaiah, M.K. et al. (2024). Integration of Memristive Devices into a 130 nm CMOS Baseline Technology. In: Ziegler, M., Mussenbrock, T., Kohlstedt, H. (eds) Bio-Inspired Information Pathways. Springer Series on Bio- and Neurosystems, vol 16. Springer, Cham. https://doi.org/10.1007/978-3-031-36705-2_7
Faculties an central facilities:Fachbereich Ingenieur- und Naturwissenschaften
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 621 Angewandte Physik
Licence (German):Creative Commons - CC BY - Namensnennung 4.0 International
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