Novel UV-transparent 2-component polyurethane resin for chip-on-board LED micro lenses
- In this work we present a novel optical polymer system based on polyurethane elastomer components, which combines excellent UV transparency with high thermal stability, good hardness, high surface tension and long pot life. The material looks very promising for encapsulation and microlensing applications for chip-on-board (CoB) light-emitting diodes (LED). The extinction coefficient k, refractive index n, and bandgap parameters were derived from transmission and reflection measurements in a wavelength range of 200-890 nm. Thermogravimetry and differential scanning calorimetry were used to provide glass transition and degradation temperatures. The surface tension was determined by means of contact angle measurements. As proof of concept, a commercial InGaN-CoB-LED is used to demonstrate the suitability of the new material for the production of microlenses.
| Author: | Joachim Bauer, Marko Gutke, Friedhelm Heinrich, Matthias Edling, Vesela Stoycheva, Alexander Kaltenbach, Martin Burkhardt, Martin Gruenefeld, Matthias Gamp, Christoph GerhardORCiD, Patrick SteglichORCiD, Sebastian Steffen, Michael HerzogORCiD, Christian DreyerORCiDGND, Sigurd SchraderORCiD |
|---|---|
| URN: | urn:nbn:de:kobv:526-opus4-13472 |
| DOI: | https://doi.org/10.1364/OME.393844 |
| ISSN: | 2159-3930 |
| Parent Title (English): | Optical Materials Express |
| Document Type: | Article |
| Language: | English |
| Year of Publication: | 2020 |
| Publishing Institution: | Technische Hochschule Wildau |
| Release Date: | 2020/08/31 |
| Volume: | 10 |
| Issue: | 9 |
| First Page: | 2085 |
| Last Page: | 2099 |
| Copyright: | © 2020 Optical Society of America. Users may use, reuse, and build upon the article, or use the article for text or data mining, so long as such uses are for non-commercial purposes and appropriate attribution is maintained. All other rights are reserved. |
| Faculties an central facilities: | Fachbereich Ingenieur- und Naturwissenschaften |
| Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 621 Angewandte Physik |
| Funding: | DFG-geförderter Publikationsfonds |
| Licence (English): |
