TY - JOUR A1 - Steglich, Patrick A1 - Bondarenko, Siegfried A1 - Mai, Christian A1 - Paul, Martin A1 - Weller, Michael G. A1 - Mai, Andreas T1 - CMOS-Compatible Silicon Photonic Sensor for Refractive Index Sensing Using Local Back-Side Release JF - IEEE Photonics Technology Letters N2 - Silicon photonic sensors are promising candidates for lab-on-a-chip solutions with versatile applications and scalable production prospects using complementary metal-oxide semiconductor (CMOS) fabrication methods. However, the widespread use has been hindered because the sensing area adjoins optical and electrical components making packaging and sensor handling challenging. In this work, a local back-side release of the photonic sensor is employed, enabling a separation of the sensing area from the rest of the chip. This approach allows preserving the compatibility of photonic integrated circuits in the front-end of line and metal interconnects in the back-end of line. The sensor is based on a micro-ring resonator and is fabricated on wafer-level using a CMOS technology. We revealed a ring resonator sensitivity for homogeneous sensing of 106 nm/RIU. Y1 - 2020 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:526-opus4-13649 SN - 1941-0174 VL - 32 IS - 19 SP - 1241 EP - 1244 ER - TY - CHAP A1 - Steglich, Patrick A1 - Paul, Martin A1 - Mai, Christian A1 - Böhme, Andrea A1 - Bondarenko, Siegfried A1 - Weller, Michael G. A1 - Mai, Andreas T1 - A monolithically integrated micro fluidic channel in a silicon-based photonic-integrated-circuit technology for biochemical sensing T2 - Proc. SPIE 11772, Optical Sensors 2021 N2 - In this work, a cost-effective optofluidic system is propossed and preliminary experimental results are presented. A microfluidic channel monolithically integrated into a photonic integrated circuit technology is used in conjunc- tion with a cyclo-olefin copolymer (COC) substrate to provide fluidic in- and output ports. We report on initial experimental results as well as on the simple and cost-effective fabrication of this optofluidic system by means of micro-milling. Y1 - 2021 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:526-opus4-13925 ER - TY - CHAP A1 - Fünning, Tabea A1 - Peczek, Anna A1 - Kroh, Aleksandra A1 - Mai, Christian A1 - Paul, Martin A1 - Thomsen, Florian A1 - Tannenberg, Robert A1 - Schumann, Christoph A1 - Weller, Michael G. A1 - Mai, Andreas A1 - Steglich, Patrick ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Optimization of local backside released micro-ring resonators for sensing applications using silicon photonic integrated circuits in a SOI technology T2 - Proceedings of SPIE : Optical Sensors 2025 N2 - Photonic micro-ring resonators (MRR) are widely studied for their high sensitivity across applications like environmental monitoring, healthcare, and chemical analysis. Their evanescent field sensing requires partially unembedded waveguides compatible with CMOS processing. Our approach uses local backside etching with an additional buried oxide (BOX) etch to release waveguides while preserving the back-end of line (BEOL) structure, enabling spatial separation of the sensing area and electronics. The BOX etch critically affects sensor performance, as waveguide surface roughness can alter MRR properties and coupling. We analyzed MRR design variations, comparing wet and dry etching techniques for their effects on optical performance across rib and strip waveguides in quasi-TE and quasi-TM modes. Wafer-level measurements show that backside-released MRR achieve high extinction ratios with slightly reduced quality factors, advancing high-sensitivity photonic sensors. KW - photonic sensor KW - micro-ring resonator (MRR) KW - silicon-on-insulator (SOI) KW - local backside etching (LBE) Y1 - 2025 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:526-opus4-20449 VL - 13527 PB - SPIE ER -