<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>1230</id>
    <completedYear>2019</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>3</issue>
    <volume>11</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">On-Chip Dispersion Measurement of the Quadratic Electro-Optic Effect in Nonlinear Optical Polymers Using a Photonic Integrated Circuit Technology</title>
    <abstract language="eng">A novel method to determine the dispersion of the quadratic electro-optic effect in nonlinear optical materials by using a silicon-on-insulator microring resonator is presented. The microring consists of a silicon slot waveguide enabling large dc electric field strength at low applied voltages. The dispersion of third-order hyperpolarizability of a linear conjugated dye is approximated by using a two-level model for the off-resonant spectral region. As an example, the dispersion of the resonance wavelength of the resonator filled with a dye doped polymer was measured in dependence of the applied dc voltage. The polymer was poly (methylmethacrylate) doped with 5 wt% disperse red 1 (DR1), and the measurements have been carried out at the telecommunication wavelength band around 1550 nm (optical C-band). The described measurements represent a new technique to determine the dispersion of the third-order susceptibility and molecular hyperpolarizability of the material filled into the slot of the ring-resonator.</abstract>
    <parentTitle language="eng">IEEE Photonics Journal</parentTitle>
    <identifier type="issn">1943-0655</identifier>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-12307</identifier>
    <enrichment key="SourceTitle">P. Steglich et al., "On-Chip Dispersion Measurement of the Quadratic Electro-Optic Effect in Nonlinear Optical Polymers Using a Photonic Integrated Circuit Technology," in IEEE Photonics Journal, vol. 11, no. 3, pp. 1-10, June 2019, Art no. 4900510. doi: 10.1109/JPHOT.2019.2917665</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1109/JPHOT.2019.2917665</enrichment>
    <licence>Creative Commons - CC BY 3.0 - Namensnennung 3.0 Unported</licence>
    <author>Patrick Steglich</author>
    <author>Claus Villringer</author>
    <author>Birgit Dietzel</author>
    <author>Christian Mai</author>
    <author>Sigurd Schrader</author>
    <author>Mauro Casalboni</author>
    <author>Andreas Mai</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>electro-optical device</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>nonlinear optics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>integrated optics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>integrated optics material</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical material</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>integrated optics device</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>polymer active device</value>
    </subject>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="Funding" number="">DFG-geförderter Publikationsfonds</collection>
    <collection role="green_open_access" number="1">Gold Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1230/08718361.pdf</file>
  </doc>
  <doc>
    <id>1388</id>
    <completedYear>2021</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>2</issue>
    <volume>3</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Silicon-organic hybrid photonics: an overview of recent advances, electro-optical effects and CMOS integration concepts</title>
    <abstract language="eng">In recent decades, much research effort has been invested in the development of photonic integrated circuits, and silicon-on-insulator technology has been established as a reliable platform for highly scalable silicon-based electro-optical modulators. However, the performance of such devices is restricted by the inherent material properties of silicon. An approach to overcoming these deficiencies is to integrate organic materials with exceptionally high optical nonlinearities into a silicon-on-insulator photonic platform. Silicon–organic hybrid photonics has been shown to overcome the drawbacks of silicon-based modulators in terms of operating speed, bandwidth, and energy consumption. This work reviews recent advances in silicon–organic hybrid photonics and covers the latest improvements to single components and device concepts. Special emphasis is given to the in-device performance of novel electro-optical polymers and the use of different electro-optical effects, such as the linear and quadratic electro-optical effect, as well as the electric-field-induced linear electro-optical effect. Finally, the inherent challenges of implementing non-linear optical polymers on a silicon photonic platform are discussed and a perspective for future directions is given.</abstract>
    <parentTitle language="eng">Journal of Physics: Photonics</parentTitle>
    <identifier type="issn">2515-7647</identifier>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-13882</identifier>
    <enrichment key="opus.import.date">2021-04-07T07:13:01+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">sword</enrichment>
    <enrichment key="opus.import.file">filename=phpVyKHrO</enrichment>
    <enrichment key="opus.import.checksum">771b29513d6504f20e045f4cf7af0810</enrichment>
    <enrichment key="SourceTitle">Patrick Steglich et al 2021 J. Phys. Photonics 3 022009</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1088/2515-7647/abd7cf</enrichment>
    <licence>Creative Commons - CC BY - Namensnennung 4.0 International</licence>
    <author>Patrick Steglich</author>
    <author>Christian Mai</author>
    <author>Claus Villringer</author>
    <author>Birgit Dietzel</author>
    <author>Siegfried Bondarenko</author>
    <author>Viachaslau Ksianzou</author>
    <author>Francesco Villasmunta</author>
    <author>Christoph Zesch</author>
    <author>Silvio Pulwer</author>
    <author>Martin Burger</author>
    <author>Joachim Bauer</author>
    <author>Friedhelm Heinrich</author>
    <author>Sigurd Schrader</author>
    <author>Francesco Vitale</author>
    <author>Fabio De Matteis</author>
    <author>Paolo Prosposito</author>
    <author>Mauro Casalboni</author>
    <author>Andreas Mai</author>
    <collection role="ddc" number="620">Ingenieurwissenschaften und zugeordnete Tätigkeiten</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="Import" number="import">Import</collection>
    <collection role="green_open_access" number="1">Gold Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1388/Steglich_2021_J._Phys._Photonics_3_022009.pdf</file>
  </doc>
  <doc>
    <id>1214</id>
    <completedYear>2018</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>15</issue>
    <volume>43</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Quadratic electro-optic effect in silicon-organic hybrid slot-waveguides</title>
    <abstract language="eng">This Letter reports on the quadratic electro-optic effect of polymers, observed in a silicon slot-waveguide at low voltages. We demonstrate that in narrow slots, the electro-optic response with respect to refractive index change is strong enough for on-chip wavelength tuning and intensity modulation using voltages as low as 1 V. A silicon slot-waveguide embedded by a nonlinear optical polymer, consisting of the dye Disperse Red 1 in poly(methyl methacrylate), serves as the phase shifter in a racetrack ring resonator. As deduced from the experimental data, the third-order susceptibility of the utilized electro-optic polymer is about 2·10−19 m2/V2. The demonstrated low-voltage operation and inherently thermal stability show the potential for silicon-organic hybrid devices using the quadratic electro-optic effect.</abstract>
    <parentTitle language="eng">Optics Letters</parentTitle>
    <identifier type="issn">1539-4794</identifier>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-12148</identifier>
    <enrichment key="CopyrightInfo">© 2018 Optical Society of America. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modifications of the content of this paper are prohibited.</enrichment>
    <enrichment key="SourceTitle">Patrick Steglich, Christian Mai, Claus Villringer, Silvio Pulwer, Mauro Casalboni, Sigurd Schrader, and Andreas Mai, "Quadratic electro-optic effect in silicon-organic hybrid slot-waveguides," Opt. Lett. 43, 3598-3601 (2018)</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1364/OL.43.003598</enrichment>
    <licence>Das Dokument ist urheberrechtlich geschützt.</licence>
    <author>Patrick Steglich</author>
    <author>Christian Mai</author>
    <author>Claus Villringer</author>
    <author>Silvio Pulwer</author>
    <author>Mauro Casalboni</author>
    <author>Sigurd Schrader</author>
    <author>Andreas Mai</author>
    <collection role="ddc" number="535">Licht, Infrarot- und Ultraviolettphänomene</collection>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="green_open_access" number="2">Green Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1214/AS6508168893071391532178246851_content_1.pdf</file>
  </doc>
  <doc>
    <id>1375</id>
    <completedYear>2017</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Very high aspect ratio through silicon via reflectometry</title>
    <abstract language="eng">Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to 10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.</abstract>
    <parentTitle language="eng">Proceedings of SPIE</parentTitle>
    <identifier type="issn">1996-756X</identifier>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-13758</identifier>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="CopyrightInfo">Copyright (2017) Society of Photo‑Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this publication for a fee or for commercial purposes, and modification of the contents of the publication are prohibited.</enrichment>
    <enrichment key="SourceTitle">J. Bauer, F. Heinrich, O. Fursenko, S. Marschmeyer, A. Bluemich, S. Pulwer, P. Steglich, C. Villringer, A. Mai, and S. Schrader "Very high aspect ratio through silicon via reflectometry", Proc. SPIE 10329, Optical Measurement Systems for Industrial Inspection X, 103293J (26 June 2017); https://doi.org/10.1117/12.2269957</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1117/12.2269957</enrichment>
    <licence>Das Dokument ist urheberrechtlich geschützt.</licence>
    <author>Joachim Bauer</author>
    <author>Friedhelm Heinrich</author>
    <author>Oksana Fursenko</author>
    <author>Steffen Marschmeyer</author>
    <author>Adrian Bluemich</author>
    <author>Silvio Pulwer</author>
    <author>Patrick Steglich</author>
    <author>Claus Villringer</author>
    <author>Andreas Mai</author>
    <author>Sigurd Schrader</author>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="green_open_access" number="2">Green Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1375/103293J.pdf</file>
  </doc>
  <doc>
    <id>1373</id>
    <completedYear>2020</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>5</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>Materials Research Forum LLC</publisherName>
    <publisherPlace>Millersville, PA</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Characterization and Tests of Different Mach-Zehnder Silicon Photonic Modulator Configurations</title>
    <abstract language="eng">We designed and produced an integrated silicon photonic circuit, in a single chip with IHP SG25H4_EPIC 0.25 µm technology. A Mach-Zehnder interferometer with an alternative shape for better integration, together with a standard-shape Mach-Zehnder interferometer have been realized. In this work, preliminary results of comparative performance measurements between the two Mach-Zehnder interferometer are shown.</abstract>
    <parentTitle language="eng">Photonics and Photoactive Materials</parentTitle>
    <identifier type="isbn">978-1-64490-071-0</identifier>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-13731</identifier>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="SourceTitle">Davide Badoni, Vincenzo Bonaiuto, Mauro Casalboni, Fabio De Matteis, Giovanni Di Giuseppe, Luca Frontini, Roberto Gunnella, Valentino Liberali, Andreas Mai, Giovanni Paoluzzi, Paolo Prosposito, Andrea Salamon, Gaetano Salina, Fausto Sargeni, Sigurd Schrader, Alberto Stabile, Patrick Steglich, Characterization and Tests of Different Mach-Zehnder Silicon Photonic Modulator Configurations, Materials Research Proceedings, Vol. 16, pp 1-5, 2020</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.21741/9781644900710-1</enrichment>
    <licence>Creative Commons - CC BY 3.0 - Namensnennung 3.0 Unported</licence>
    <author>Davide Badoni</author>
    <author>Vincenzo Bonaiuto</author>
    <author>Mauro Casalboni</author>
    <author>Fabio De Matteis</author>
    <author>Giovanni Di Giuseppe</author>
    <author>Luca Frontini</author>
    <author>Roberto Gunnella</author>
    <author>Valentino Liberali</author>
    <author>Andreas Mai</author>
    <author>Giovanni Paoluzzi</author>
    <author>Paolo Prosposito</author>
    <author>Andrea Salamon</author>
    <author>Gaetano Salina</author>
    <author>Fausto Sargeni</author>
    <author>Sigurd Schrader</author>
    <author>Alberto Stabile</author>
    <author>Patrick Steglich</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>CMOS</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Mach-Zehnder</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>VLSI</value>
    </subject>
    <collection role="ddc" number="620">Ingenieurwissenschaften und zugeordnete Tätigkeiten</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1373/1.pdf</file>
  </doc>
  <doc>
    <id>2082</id>
    <completedYear>2026</completedYear>
    <publishedYear>2025</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>2</issue>
    <volume>32</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects</title>
    <abstract language="eng">The scaling limitations of electrical interconnects are driving the demand for efficient optical chip-to-chip links. We report the first monolithic integration of air-clad optical through-silicon waveguides in silicon, fabricated via Bosch and cryogenic deep reactive-ion etching. Rib, single-bridge, and double-bridge designs with 50 μm cores and up to 150 μm propagation lengths have been evaluated. Cryogenic-etched rib waveguides achieve the highest median transmission (66%, −1.80 dB), compared to Bosch-etched ribs (62%, −2.08 dB). Across all geometries, 3 dB alignment windows range from 9.3 μm to 49.2 μm, with Bosch-etched double-bridge waveguides providing the broadest tolerance. We show that geometric fidelity outweighs sidewall roughness for transmission and alignment in these large-core, multimode optical through-silicon waveguides. This technology provides a scalable, complementary metal-oxide semiconductor-compatible pathway toward 3D photonic interconnects.</abstract>
    <parentTitle language="eng">IEEE Journal of Selected Topics in Quantum Electronics</parentTitle>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-20828</identifier>
    <enrichment key="opus.import.date">2025-09-29T08:03:00+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">sword</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1109/JSTQE.2025.3615001</enrichment>
    <enrichment key="SourceTitle">Villasmunta, F., Heise, P., Breiter, M., Schrader, S., Schenk, H., Regehly, M., &amp; Mai, A. (2025). Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, 32(2), 3700215. doi:10.1109/JSTQE.2025.3615001</enrichment>
    <licence>Creative Commons - CC BY - Namensnennung 4.0 International</licence>
    <author>Francesco Villasmunta</author>
    <author>Patrick Heise</author>
    <author>Manuela Breiter</author>
    <author>Sigurd Schrader</author>
    <author>Harald Schenk</author>
    <author>Martin Regehly</author>
    <author>Andreas Mai</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical waveguide</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical device fabrication</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>three-dimensional display</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical loss</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical interconnection</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>coupling</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical surface wave</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical coupling</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>coupler</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon photonics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>three-dimensional integrated circuit</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>through-silicon vias (TSV)</value>
    </subject>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="Import" number="import">Import</collection>
    <collection role="green_open_access" number="4">Hybrid Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/2082/2082.pdf</file>
  </doc>
  <doc>
    <id>1975</id>
    <completedYear>2024</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>12892</volume>
    <type>conferenceobject</type>
    <publisherName>Society of Photo-Optical Instrumentation Engineers (SPIE)</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections</title>
    <abstract language="eng">In the context of an ever-growing volume of data generated by established and emerging technologies, such as 5G, the Internet of Things, artificial intelligence, machine learning, blockchain, and virtual reality, faster communication speed is demanded by data centers and high-performance computing. Transceiver requirements surged from 100 to 400 Gb/s and beyond. In this scenario, photonics aims to enable Tb/s optical communication at energies below 1 pJ/bit. Targeting higher communication rates while maintaining a low power budget can significantly benefit from 3D photonic chip architectures. This paper presents the simulation-based design, fabrication, and characterization of a monolithically integrated optical through-silicon waveguide that facilitates the connection between different surfaces of a silicon chip. Deep reactive ion etching was employed in both the Bosch and Cryogenic variants to evaluate the effect of sidewall roughness on propagation losses. The mechanical stability of the waveguide was ensured by interrupting the annular trench with a bridging structure. The high-refractive-index contrast to air provides tight light confinement for a core size of up to 50 μm and multimode operation at 1550 nm. The morphology was characterized using scanning electron microscopy (SEM), and optical transmission characterization was performed using relative power loss measurements. A tunable laser source was buttcoupled to a waveguide to analyze light transmission efficiency. Preliminary measurements using single-mode fiber show that the transmitted values exceeded 99% for all structures.</abstract>
    <parentTitle language="eng">Optical Interconnects XXIV</parentTitle>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-19759</identifier>
    <enrichment key="opus.import.date">2024-12-20T06:38:04+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">sword</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1117/12.3003146</enrichment>
    <enrichment key="SourceTitle">Francesco Villasmunta, Patrick Steglich, Claus Villringer, Sigurd Schrader, Harald Schenk, Andreas Mai, and Martin Regehly "Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections", Proc. SPIE 12892, Optical Interconnects XXIV, 128920I (11 March 2024); https://doi.org/10.1117/12.3003146</enrichment>
    <licence>Das Dokument ist urheberrechtlich geschützt.</licence>
    <author>Francesco Villasmunta</author>
    <author>Patrick Steglich</author>
    <author>Claus Villringer</author>
    <author>Sigurd Schrader</author>
    <author>Harald Schenk</author>
    <author>Andreas Mai</author>
    <author>Martin Regehly</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>multimode photonics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>cryogenic etching</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>ICP-DRIE</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical interconnects</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon photonics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>3D chip stacking</value>
    </subject>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="Import" number="import">Import</collection>
    <collection role="green_open_access" number="2">Green Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1975/128920I.pdf</file>
  </doc>
</export-example>
