<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>1975</id>
    <completedYear>2024</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>12892</volume>
    <type>conferenceobject</type>
    <publisherName>Society of Photo-Optical Instrumentation Engineers (SPIE)</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections</title>
    <abstract language="eng">In the context of an ever-growing volume of data generated by established and emerging technologies, such as 5G, the Internet of Things, artificial intelligence, machine learning, blockchain, and virtual reality, faster communication speed is demanded by data centers and high-performance computing. Transceiver requirements surged from 100 to 400 Gb/s and beyond. In this scenario, photonics aims to enable Tb/s optical communication at energies below 1 pJ/bit. Targeting higher communication rates while maintaining a low power budget can significantly benefit from 3D photonic chip architectures. This paper presents the simulation-based design, fabrication, and characterization of a monolithically integrated optical through-silicon waveguide that facilitates the connection between different surfaces of a silicon chip. Deep reactive ion etching was employed in both the Bosch and Cryogenic variants to evaluate the effect of sidewall roughness on propagation losses. The mechanical stability of the waveguide was ensured by interrupting the annular trench with a bridging structure. The high-refractive-index contrast to air provides tight light confinement for a core size of up to 50 μm and multimode operation at 1550 nm. The morphology was characterized using scanning electron microscopy (SEM), and optical transmission characterization was performed using relative power loss measurements. A tunable laser source was buttcoupled to a waveguide to analyze light transmission efficiency. Preliminary measurements using single-mode fiber show that the transmitted values exceeded 99% for all structures.</abstract>
    <parentTitle language="eng">Optical Interconnects XXIV</parentTitle>
    <identifier type="urn">urn:nbn:de:kobv:526-opus4-19759</identifier>
    <enrichment key="opus.import.date">2024-12-20T06:38:04+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">sword</enrichment>
    <enrichment key="DOI_VoR">https://doi.org/10.1117/12.3003146</enrichment>
    <enrichment key="SourceTitle">Francesco Villasmunta, Patrick Steglich, Claus Villringer, Sigurd Schrader, Harald Schenk, Andreas Mai, and Martin Regehly "Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections", Proc. SPIE 12892, Optical Interconnects XXIV, 128920I (11 March 2024); https://doi.org/10.1117/12.3003146</enrichment>
    <licence>Das Dokument ist urheberrechtlich geschützt.</licence>
    <author>Francesco Villasmunta</author>
    <author>Patrick Steglich</author>
    <author>Claus Villringer</author>
    <author>Sigurd Schrader</author>
    <author>Harald Schenk</author>
    <author>Andreas Mai</author>
    <author>Martin Regehly</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>multimode photonics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>cryogenic etching</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>ICP-DRIE</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>optical interconnects</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon photonics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>3D chip stacking</value>
    </subject>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="">Fachbereich Ingenieur- und Naturwissenschaften</collection>
    <collection role="open_access" number="">open_access</collection>
    <collection role="Import" number="import">Import</collection>
    <collection role="green_open_access" number="2">Green Open Access</collection>
    <thesisPublisher>Technische Hochschule Wildau</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-th-wildau/files/1975/128920I.pdf</file>
  </doc>
</export-example>
