@inproceedings{SteglichMaiStolareketal.2016, author = {Steglich, Patrick and Mai, Christian and Stolarek, David and Lischke, Stefan and Kupijai, Sebastian and Villringer, Claus and Pulwer, Silvio and Heinrich, Friedhelm and Bauer, Joachim and Meister, Stefan and Knoll, Dieter and Casalboni, Mauro and Schrader, Sigurd}, title = {Partially slotted silicon ring resonator covered with electro-optical polymer}, series = {Proceedings of SPIE}, booktitle = {Proceedings of SPIE}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13771}, year = {2016}, abstract = {In this work, we present for the first time a partially slotted silicon ring resonator (PSRR) covered with an electro-optical polymer (Poly[(methyl methacrylate)-co-(Disperse Red 1 acrylate)]). The PSRR takes advantage of both a highly efficient vertical slot waveguide based phase shifter and a low loss strip waveguide in a single ring. The device is realized on 200 mm silicon-on-insulator wafers using 248 nm DUV lithography and covered with the electro-optic polymer in a post process. This silicon-organic hybrid ring resonator has a small footprint, high optical quality factor, and high DC device tunability. A quality factor of up to 105 and a DC device tunability of about 700 pm/V is experimentally demonstrated in the wavelength range of 1540 nm to 1590 nm. Further, we compare our results with state-of-the-art silicon-organic hybrid devices by determining the poling efficiency. It is demonstrated that the active PSRR is a promising candidate for efficient optical switches and tunable filters.}, language = {en} } @inproceedings{PadillaMichelPulwerSaffarietal.2016, author = {Padilla-Michel, Yazmin and Pulwer, Silvio and Saffari, Pouneh and Ksianzou, Viachaslau and Schrader, Sigurd}, title = {On the origin and removal of interference patterns in coated multimode fibres}, publisher = {Society of Photo-Optical Instrumentation Engineers (SPIE)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15295}, pages = {1517 -- 1527}, year = {2016}, abstract = {In this study, we present the experimental investigations on interference patterns, such as those already reported in VIMOS-IFU, and up to now no appropriate explanation has been presented. These interference patterns are produced in multimode fibres coated with acrylate or polyimide, which is the preferred coating material for the fibres used in IFUs. Our experiments show that, under specific conditions, cladding modes interact with the coating and produce interference. Our results show that the conditions at which the fibre is held during data acquisition has an impact in the output spectrum. Altering the positioning conditions of the fibre leads to the changes into the interference pattern, therefore, fibres should be carefully manipulated in order to minimise this potential problem and improve the performance of these instruments. Finally we present a simple way of predicting and modelling this interference produced from the visible to the near infrared spectra. This model can be included in the data reduction pipeline in order to remove the interference patterns. These results should be of interest for the optimisation of the data reduction pipelines of instruments using optical fibres. Considering these results will benefit innovations and developments of high performance fibre systems.}, language = {en} } @inproceedings{PulwerSteglichVillringeretal.2016, author = {Pulwer, Silvio and Steglich, Patrick and Villringer, Claus and Bauer, Joachim and Burger, Martin and Franz, M. and Grieshober, K. and Wirth, F. and Blondeau, J. and Rautenberg, J. and Mouti, S. and Schrader, Sigurd}, title = {Triangulation-based 3D surveying borescope}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15307}, pages = {51 -- 56}, year = {2016}, abstract = {In this work, a measurement concept based on triangulation was developed for borescopic 3D-surveying of surface defects. The integration of such measurement system into a borescope environment requires excellent space utilization. The triangulation angle, the projected pattern, the numerical apertures of the optical system, and the viewing angle were calculated using partial coherence imaging and geometric optical raytracing methods. Additionally, optical aberrations and defocus were considered by the integration of Zernike polynomial coefficients. The measurement system is able to measure objects with a size of 50 μm in all dimensions with an accuracy of ± 5 μm. To manage the issue of a low depth of field while using an optical high resolution system, a wavelength dependent aperture was integrated. Thereby, we are able to control depth of field and resolution of the optical system and can use the borescope in measurement mode with high resolution and low depth of field or in inspection mode with low resolution and higher depth of field. First measurements of a demonstrator system are in good agreement with our simulations.}, language = {en} } @inproceedings{PulwerJahnsVillringeretal.2020, author = {Pulwer, Silvio and Jahns, Daniel and Villringer, Claus and Schrader, Sigurd}, title = {Dynamic pattern generation by singlemode fibers for endoscopic 3D measurement systems}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15364}, year = {2020}, abstract = {This work presents experimental and simulation results of a 3D measurement concept based on fiber-optic interference pattern generation. A demonstrator system which is able to adjust different optical and mechanical parameters is described. The results of parameter variation studies are discussed along with possible applications in the field of micro-optical 3D measurement systems like endoscopes. The experiments were prepared with different structures with various scattering properties. To implement that approach into a micro-optical 3D measurement system, the combination of distance variation between the fibers and a controlled phase shift introduced by a retarder can be used to design the system versatile.}, language = {en} } @inproceedings{GilaniVillringerZhangetal.2018, author = {Gilani, Taravat Saeb and Villringer, Claus and Zhang, Edward and Gundlach, H. and Buchmann, Jens and Schrader, Sigurd and Laufer, Jan}, title = {Parallelised photoacoustic signal acquisition using a Fabry-Perot sensor and a camera-based interrogation scheme}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15335}, pages = {217 -- 222}, year = {2018}, abstract = {Tomographic photoacoustic (PA) images acquired using a Fabry-Perot (FP) based scanner offer high resolution and image fidelity but can result in long acquisition times due to the need for raster scanning. To reduce the acquisition times, a parallelised camera-based PA signal detection scheme is developed. The scheme is based on using a sCMOScamera and FPI sensors with high homogeneity of optical thickness. PA signals were acquired using the camera-based setup and the signal to noise ratio (SNR) was measured. A comparison of the SNR of PA signal detected using 1) a photodiode in a conventional raster scanning detection scheme and 2) a sCMOS camera in parallelised detection scheme is made. The results show that the parallelised interrogation scheme has the potential to provide high speed PA imaging.}, language = {en} } @inproceedings{VillringerGilaniZhangetal.2019, author = {Villringer, Claus and Gilani, Taravat Saeb and Zhang, Edward and Pulwer, Silvio and Steglich, Patrick and Schrader, Sigurd and Laufer, Jan}, title = {Development of tuneable Fabry-P{\´e}rot sensors for parallelised photoacoustic signal acquisition}, series = {Proc. SPIE 10878, Photons Plus Ultrasound: Imaging and Sensing 2019, 108780M (8 March 2019)}, booktitle = {Proc. SPIE 10878, Photons Plus Ultrasound: Imaging and Sensing 2019, 108780M (8 March 2019)}, publisher = {Society of Photo-Optical Instrumentation Engineers (SPIE)}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13769}, year = {2019}, abstract = {Fabry-P{\´e}rot (FP) sensors have enabled high resolution 3D photoacoustic (PA) imaging in backward mode. However, raster-scanning of the interrogation laser beam across the sensor can result in slow 3D image acquisition. To overcome this limitation, parallelized PA signal acquisition can be used for which FP sensors with uniform optical thickness are required. In this work, the optical thickness is tuned a) irreversibly through the use of a photopolymer host matrix and b) actively using embedded electro-optic (EO) chromophores. Polymer spacers (5 μm) were deposited using spin coating and sandwiched between two dielectric mirrors and transparent ITO electrodes. The employed polymer guest-host system consists of an EO chromophore (2-methyl-4-nitroaniline) and poly(vinyl cinnamate). EO tuneability was induced using contact poling and a tuneability of 68 pm was demonstrated. The optical thickness was homogenised by raster scanning a UV beam whilst varying the exposure time across a 4 mm2 detection aperture.}, language = {en} } @inproceedings{BauerHeinrichFursenkoetal.2017, author = {Bauer, Joachim and Heinrich, Friedhelm and Fursenko, Oksana and Marschmeyer, Steffen and Bluemich, Adrian and Pulwer, Silvio and Steglich, Patrick and Villringer, Claus and Mai, Andreas and Schrader, Sigurd}, title = {Very high aspect ratio through silicon via reflectometry}, series = {Proceedings of SPIE}, booktitle = {Proceedings of SPIE}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13758}, year = {2017}, abstract = {Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to 10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.}, language = {en} } @article{BauerGutkeHeinrichetal.2020, author = {Bauer, Joachim and Gutke, Marko and Heinrich, Friedhelm and Edling, Matthias and Stoycheva, Vesela and Kaltenbach, Alexander and Burkhardt, Martin and Gruenefeld, Martin and Gamp, Matthias and Gerhard, Christoph and Steglich, Patrick and Steffen, Sebastian and Herzog, Michael and Dreyer, Christian and Schrader, Sigurd}, title = {Novel UV-transparent 2-component polyurethane resin for chip-on-board LED micro lenses}, series = {Optical Materials Express}, volume = {10}, journal = {Optical Materials Express}, number = {9}, issn = {2159-3930}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13472}, pages = {2085 -- 2099}, year = {2020}, abstract = {In this work we present a novel optical polymer system based on polyurethane elastomer components, which combines excellent UV transparency with high thermal stability, good hardness, high surface tension and long pot life. The material looks very promising for encapsulation and microlensing applications for chip-on-board (CoB) light-emitting diodes (LED). The extinction coefficient k, refractive index n, and bandgap parameters were derived from transmission and reflection measurements in a wavelength range of 200-890 nm. Thermogravimetry and differential scanning calorimetry were used to provide glass transition and degradation temperatures. The surface tension was determined by means of contact angle measurements. As proof of concept, a commercial InGaN-CoB-LED is used to demonstrate the suitability of the new material for the production of microlenses.}, language = {en} } @inproceedings{PrelipceanuCojocariuGrauretal.2015, author = {Prelipceanu, Marius and Cojocariu, Lucian and Graur, Adrian and Schrader, Sigurd}, title = {Analysis of thermally stimulated processes in new phenanthroline derivatives suitable for optoelectronic devices}, series = {Journal of Physics: Conference Series (JPCONF)}, volume = {585}, booktitle = {Journal of Physics: Conference Series (JPCONF)}, issn = {1742-6596}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-12050}, year = {2015}, abstract = {Thermally stimulated processes have been studied in thin films of phenanthroline derives to describe the states that had been localized. Ultraviolet Photoelectron Spectroscopy had checked out before thin films of new pyrrolo[l,2-a][l,10] phenanthroline derivatives [1], in order to further applications in optoelectronic devices. The investigated compounds have an electronic band structure which is due to the substituent (R=NO2, Cl) induced transformations of molecular orbitals. Thermally stimulated discharge currents (TSDC) attested dipolar and charge transport mechanisms. Each TSDC peak has been assigned to elementary processes that are different utilizing in addition dielectric spectroscopy (DES), and the mean trap depths have been approximated from thermally stimulated luminescence (TSL) curves.}, language = {en} } @misc{LangeMessaoudiDasetal.2014, author = {Lange, Janine and Messaoudi, Hamza and Das, Susanta Kumar and Grunwald, R{\"u}diger and Schrader, Sigurd and Frohme, Marcus and Heinrich, Friedhelm}, title = {Analyse komplexer biologischer Proben mittels oberfl{\"a}chenverst{\"a}rkter Ramanspektroskopie (SERS)}, series = {Wissenschaftliche Beitr{\"a}ge 2014}, volume = {18}, journal = {Wissenschaftliche Beitr{\"a}ge 2014}, issn = {0949-8214}, doi = {10.15771/0949-8214_2014_1_3}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-3300}, pages = {27 -- 32}, year = {2014}, abstract = {Diese Studie besch{\"a}ftigt sich mit dem Nachweis biologischer Proben mit Hilfe der Raman-Mikroskopie. Um ausreichende Signalintensit{\"a}ten auch bei niedrigen Konzentrationen zu erhalten, wurde insbesondere der Effekt der oberfl{\"a}chenverst{\"a}rkten Raman-Streuung (SERS) n{\"a}her untersucht. Als Proben dienten DNA aus Hering-Sperma und das Protein Albumin. Zur Verst{\"a}rkung des Raman-Spektrums wurden zwei unterschiedliche Methoden verwendet. Zum Einen wurden in einem chemischen Reduktionsprozess Nanosilberpartikel hergestellt und den biologischen Proben zugemischt. Zum Anderen wurden mit Hilfe laserangeregter periodischer Oberfl{\"a}chenstrukturierung (LIPSS) erzeugte nanostrukturierte Silberoberfl{\"a}chen als Substrate f{\"u}r die Proben verwendet. Diese Methode wurde bislang nicht f{\"u}r die SERS-Analyse biologischer Proben eingesetzt. Erste hier pr{\"a}sentierte Messungen zeigen, dass beide Verfahren signifikante SERS-Verst{\"a}rkungen liefern und potentiell leistungsstarke Methoden f{\"u}r die zerst{\"o}rungsfreie Analyse biologischer Proben darstellen.}, language = {de} } @misc{SteglichVillringerPulweretal.2016, author = {Steglich, Patrick and Villringer, Claus and Pulwer, Silvio and Bauer, Joachim and Heinrich, Friedhelm and Casalboni, Mauro and Schrader, Sigurd}, title = {Advanced Nanophotonics: Silicon-Organic Hybrid Technology}, series = {Wissenschaftliche Beitr{\"a}ge 2016}, volume = {20}, journal = {Wissenschaftliche Beitr{\"a}ge 2016}, issn = {0949-8214}, doi = {10.15771/0949-8214_2016_1_6}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-5337}, pages = {45 -- 48}, year = {2016}, abstract = {Integrated photonic devices have gained increasing research interests. Especially silicon photonics have become very attractive for various optical applications. Using silicon-on-insulator as a material platform provides the ability to fabricate photonic devices with electronic devices on a single chip. Driven by substantial research investments, the integration of photonic devices on silicon-on-insulator substrates has reached a degree of maturity that already permits industrial adoption. However, silicon has the disadvantage of linear electro-optical effects, and, therefore, advanced modulation formats are difficult to realize when using silicon-based high-speed modulators. Hence, a new approach was proposed: the silicon-organic hybrid technology. This technology is a viable extension of the silicon-on-insulator material system for efficient high-speed modulation. We herewith present our theoretical and experimental investigations of the silicon-organic hybrid slot-waveguide ring resonator. The advanced device design is described in detail, which allows using both, the efficient silicon-on-insulator strip-waveguides and the silicon-organic hybrid slot-waveguides in single ring resonator. For the first time, we report the transmission spectra of such a resonator covered with an electro-optical polymer.}, language = {en} } @inproceedings{BadoniBonaiutoCasalbonietal.2020, author = {Badoni, Davide and Bonaiuto, Vincenzo and Casalboni, Mauro and De Matteis, Fabio and Di Giuseppe, Giovanni and Frontini, Luca and Gunnella, Roberto and Liberali, Valentino and Mai, Andreas and Paoluzzi, Giovanni and Prosposito, Paolo and Salamon, Andrea and Salina, Gaetano and Sargeni, Fausto and Schrader, Sigurd and Stabile, Alberto and Steglich, Patrick}, title = {Characterization and Tests of Different Mach-Zehnder Silicon Photonic Modulator Configurations}, series = {Photonics and Photoactive Materials}, booktitle = {Photonics and Photoactive Materials}, editor = {Prosposito, Paolo}, publisher = {Materials Research Forum LLC}, address = {Millersville, PA}, isbn = {978-1-64490-071-0}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13731}, pages = {1 -- 5}, year = {2020}, abstract = {We designed and produced an integrated silicon photonic circuit, in a single chip with IHP SG25H4_EPIC 0.25 µm technology. A Mach-Zehnder interferometer with an alternative shape for better integration, together with a standard-shape Mach-Zehnder interferometer have been realized. In this work, preliminary results of comparative performance measurements between the two Mach-Zehnder interferometer are shown.}, language = {en} } @article{LuxSiemrothSgarlataetal.2015, author = {Lux, Helge and Siemroth, Peter and Sgarlata, Anna and Prosposito, Paolo and Schubert, Markus Andreas and Casalboni, Mauro and Schrader, Sigurd}, title = {Synthesis of graphene-like transparent conductive films on dielectric substrates using a modified filtered vacuum arc system}, series = {Journal of Applied Physics}, volume = {117}, journal = {Journal of Applied Physics}, number = {19}, issn = {1089-7550}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-9738}, year = {2015}, abstract = {Here, we present a reliable process to deposit transparent conductive films on silicon oxide, quartz, and sapphire using a solid carbon source. This layer consists of partially ordered graphene flakes with a lateral dimension of about 5 nm. The process does not require any catalytic metal and exploits a high current arc evaporation (Φ-HCA) to homogeneously deposit a layer of carbon on heated substrates. A gas atmosphere consisting of Argon or Argon/Hydrogen blend acting as a buffer influences the morphology of the growing film. scanning tunneling microscopy, transmission electron microscopy, and Raman spectra were used for a thorough characterization of the samples in order to optimize the growth parameters. The best carbon layers have a surface resistance of 5.7 × 103 Ω◻ whereas the optical transparency of the coatings is 88\% with an excellent homogeneity over areas of several cm2. Such results are compatible with most semiconductor fabrication processes and make this method very promising for various industrial applications.}, language = {en} } @article{ZeschFinkelsteinRegehlyetal.2026, author = {Zesch, Christoph and Finkelstein, Daniel and Regehly, Martin and Reif, J{\"u}rgen and Schrader, Sigurd}, title = {Efficient nanosecond barium nitrate Raman laser for the visible spectral range}, series = {Optics Express}, volume = {34}, journal = {Optics Express}, number = {4}, publisher = {Optica}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-21320}, pages = {6355 -- 6363}, year = {2026}, abstract = {We report on the design and performance of two solid-state Raman lasers, pumped by a frequency-doubled Nd:YAG laser at 532 nm (8 ns FWHM, 10 Hz, up to 10 mJ), that generate either the first or second Stokes radiation with wavelengths of 563 nm and 598 nm. Barium nitrate crystals with a 1 cm² face area and lengths of 3 cm and 5 cm were used as the Raman-active medium in stable semi-spherical resonators. The Raman lasers produced first Stokes and second Stokes pulses, achieving pulse energies up to 2.3 mJ and conversion efficiencies up to 35\% (first Stokes, 5 cm crystal) and 21\% (second Stokes, 5 cm crystal). The output beams exhibit nearly Gaussian profiles with beam quality factors of M² = 1.67 and M² = 1.83, respectively. The proposed design and characterization demonstrated a Raman laser with high efficiency and superior beam quality. After subsequent frequency doubling, the output appears well dedicated for future differential absorption LiDAR (DIAL) applications.}, language = {en} } @inproceedings{PulwerFiebelkornZeschetal.2019, author = {Pulwer, Silvio and Fiebelkorn, Richard and Zesch, Christoph and Steglich, Patrick and Villringer, Claus and Villasmunta, Francesco and Gedat, Egbert and Handrich, Jan and Schrader, Sigurd and Vandenhouten, Ralf}, title = {Endoscopic orientation by multimodal data fusion}, series = {Proc. SPIE 10931, MOEMS and Miniaturized Systems XVIII}, booktitle = {Proc. SPIE 10931, MOEMS and Miniaturized Systems XVIII}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-11420}, year = {2019}, abstract = {To improve the feasibility of endoscopic inspection processes we developed a system that provides online information about position, orientation and viewing direction of endoscopes, to support the analysis of endoscopic images and to ease the operational handling of the equipment. The setup is based on an industrial endoscope consisting of a camera, various MEMS and multimodal data fusion. The software contains algorithms for feature and geometric structure recognition as well as Kalman filters. To track the distal end of the endoscope and to generate 3D point cloud data in real time the optical and photometrical characteristics of the system are registered and the movement of the endoscope is reconstructed by using image processing techniques.}, language = {en} } @inproceedings{ZeschSchraderProspositoetal.2019, author = {Zesch, Christoph and Schrader, Sigurd and Prosposito, Paolo and Lux, Oliver and Eichler, Hans J.}, title = {Raman lasers for trace gas detection}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15351}, pages = {114 -- 119}, year = {2019}, abstract = {The emission of commercial solid-state lasers is shifted by Raman lasers to selected wavelengths suitable for trace gas detection. High power Raman lasers based on Ba(NO3)2, diamond and silicon detect CO2, O3 and H2O. Raman lasers base on the physical effect of stimulated Raman scattering. Two new Raman crystals (Spodumene and LuAlO3) are investigated and their SRS-spectra is shown.}, language = {en} } @article{VillasmuntaHeiseBreiteretal.2026, author = {Villasmunta, Francesco and Heise, Patrick and Breiter, Manuela and Schrader, Sigurd and Schenk, Harald and Regehly, Martin and Mai, Andreas}, title = {Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects}, series = {IEEE Journal of Selected Topics in Quantum Electronics}, volume = {32}, journal = {IEEE Journal of Selected Topics in Quantum Electronics}, number = {2}, publisher = {IEEE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-20828}, year = {2026}, abstract = {The scaling limitations of electrical interconnects are driving the demand for efficient optical chip-to-chip links. We report the first monolithic integration of air-clad optical through-silicon waveguides in silicon, fabricated via Bosch and cryogenic deep reactive-ion etching. Rib, single-bridge, and double-bridge designs with 50 μm cores and up to 150 μm propagation lengths have been evaluated. Cryogenic-etched rib waveguides achieve the highest median transmission (66\%, -1.80 dB), compared to Bosch-etched ribs (62\%, -2.08 dB). Across all geometries, 3 dB alignment windows range from 9.3 μm to 49.2 μm, with Bosch-etched double-bridge waveguides providing the broadest tolerance. We show that geometric fidelity outweighs sidewall roughness for transmission and alignment in these large-core, multimode optical through-silicon waveguides. This technology provides a scalable, complementary metal-oxide semiconductor-compatible pathway toward 3D photonic interconnects.}, language = {en} } @article{SteglichMaiVillringeretal.2021, author = {Steglich, Patrick and Mai, Christian and Villringer, Claus and Dietzel, Birgit and Bondarenko, Siegfried and Ksianzou, Viachaslau and Villasmunta, Francesco and Zesch, Christoph and Pulwer, Silvio and Burger, Martin and Bauer, Joachim and Heinrich, Friedhelm and Schrader, Sigurd and Vitale, Francesco and De Matteis, Fabio and Prosposito, Paolo and Casalboni, Mauro and Mai, Andreas}, title = {Silicon-organic hybrid photonics: an overview of recent advances, electro-optical effects and CMOS integration concepts}, series = {Journal of Physics: Photonics}, volume = {3}, journal = {Journal of Physics: Photonics}, number = {2}, issn = {2515-7647}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13882}, year = {2021}, abstract = {In recent decades, much research effort has been invested in the development of photonic integrated circuits, and silicon-on-insulator technology has been established as a reliable platform for highly scalable silicon-based electro-optical modulators. However, the performance of such devices is restricted by the inherent material properties of silicon. An approach to overcoming these deficiencies is to integrate organic materials with exceptionally high optical nonlinearities into a silicon-on-insulator photonic platform. Silicon-organic hybrid photonics has been shown to overcome the drawbacks of silicon-based modulators in terms of operating speed, bandwidth, and energy consumption. This work reviews recent advances in silicon-organic hybrid photonics and covers the latest improvements to single components and device concepts. Special emphasis is given to the in-device performance of novel electro-optical polymers and the use of different electro-optical effects, such as the linear and quadratic electro-optical effect, as well as the electric-field-induced linear electro-optical effect. Finally, the inherent challenges of implementing non-linear optical polymers on a silicon photonic platform are discussed and a perspective for future directions is given.}, language = {en} } @inproceedings{VillasmuntaSteglichVillringeretal.2024, author = {Villasmunta, Francesco and Steglich, Patrick and Villringer, Claus and Schrader, Sigurd and Schenk, Harald and Mai, Andreas and Regehly, Martin}, title = {Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections}, series = {Optical Interconnects XXIV}, volume = {12892}, booktitle = {Optical Interconnects XXIV}, editor = {Chen, Ray T. and Schr{\"o}der, Henning}, publisher = {Society of Photo-Optical Instrumentation Engineers (SPIE)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-19759}, year = {2024}, abstract = {In the context of an ever-growing volume of data generated by established and emerging technologies, such as 5G, the Internet of Things, artificial intelligence, machine learning, blockchain, and virtual reality, faster communication speed is demanded by data centers and high-performance computing. Transceiver requirements surged from 100 to 400 Gb/s and beyond. In this scenario, photonics aims to enable Tb/s optical communication at energies below 1 pJ/bit. Targeting higher communication rates while maintaining a low power budget can significantly benefit from 3D photonic chip architectures. This paper presents the simulation-based design, fabrication, and characterization of a monolithically integrated optical through-silicon waveguide that facilitates the connection between different surfaces of a silicon chip. Deep reactive ion etching was employed in both the Bosch and Cryogenic variants to evaluate the effect of sidewall roughness on propagation losses. The mechanical stability of the waveguide was ensured by interrupting the annular trench with a bridging structure. The high-refractive-index contrast to air provides tight light confinement for a core size of up to 50 μm and multimode operation at 1550 nm. The morphology was characterized using scanning electron microscopy (SEM), and optical transmission characterization was performed using relative power loss measurements. A tunable laser source was buttcoupled to a waveguide to analyze light transmission efficiency. Preliminary measurements using single-mode fiber show that the transmitted values exceeded 99\% for all structures.}, language = {en} } @article{BauerFursenkoMarschmeyeretal.2019, author = {Bauer, Joachim and Fursenko, Oksana and Marschmeyer, Steffen and Heinrich, Friedhelm and Villasmunta, Francesco and Villringer, Claus and Zesch, Christoph and Schrader, Sigurd}, title = {Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process}, series = {Journal of Vacuum Science \& Technology B}, volume = {37}, journal = {Journal of Vacuum Science \& Technology B}, number = {6}, publisher = {American Vacuum Society (AVS)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-16093}, year = {2019}, abstract = {Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a high etch rate at a high aspect ratio, whereby scallops on the sidewalls are generated. In this work, square via arrays with dimensions from 3 to 50 μm and up to 300 μm depth were fabricated and analyzed by spectroscopic reflectometry. The reflectometric data are compared to simulations by a novel theoretical approach. In order to simulate the reflectance spectra of TSV arrays, a combination of 2D and 3D rigorous coupled wave analysis was applied. Besides the via depth, the sidewall angle and the corner radius of the bottom profile were considered in the model. The general requirements on spectral resolution in TSV metrology are discussed.}, language = {en} }