@article{LuxEdlingLuccietal.2019, author = {Lux, Helge and Edling, Matthias and Lucci, Massimiliano and Kitzmann, Julia and Villringer, Claus and Siemroth, Peter and De Matteis, Fabio and Schrader, Sigurd}, title = {The Role of Substrate Temperature and Magnetic Filtering for DLC by Cathodic Arc Evaporation}, series = {Coatings}, volume = {9}, journal = {Coatings}, number = {5}, issn = {2079-6412}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-12295}, pages = {345}, year = {2019}, abstract = {Diamond-like carbon (DLC) films were deposited using two different types of high current arc evaporation. The first process used a magnetic particle filter to remove droplets from the plasma. For the second process, the samples were put into a metallic cage which was placed directly above the plasma source. For both processes, we varied the substrate temperature from 21 to 350 °C in order to investigate the temperature effect. The samples were characterized using SEM, AFM, XPS, Raman Spectroscopy, Ellipsometry, Photometry, and Nano Indentation in order to compare both methods of deposition and provide a careful characterization of such DLC films. We found that the sp3 content and the hardness can be precisely adjusted by changing the substrate temperature. Furthermore, in the case of unfiltered deposition, the optical constants can be shifted in the direction of higher absorbance in order to produce black and hard carbon coatings.}, language = {en} } @article{SteglichVillringerDietzeletal.2019, author = {Steglich, Patrick and Villringer, Claus and Dietzel, Birgit and Mai, Christian and Schrader, Sigurd and Casalboni, Mauro and Mai, Andreas}, title = {On-Chip Dispersion Measurement of the Quadratic Electro-Optic Effect in Nonlinear Optical Polymers Using a Photonic Integrated Circuit Technology}, series = {IEEE Photonics Journal}, volume = {11}, journal = {IEEE Photonics Journal}, number = {3}, issn = {1943-0655}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-12307}, year = {2019}, abstract = {A novel method to determine the dispersion of the quadratic electro-optic effect in nonlinear optical materials by using a silicon-on-insulator microring resonator is presented. The microring consists of a silicon slot waveguide enabling large dc electric field strength at low applied voltages. The dispersion of third-order hyperpolarizability of a linear conjugated dye is approximated by using a two-level model for the off-resonant spectral region. As an example, the dispersion of the resonance wavelength of the resonator filled with a dye doped polymer was measured in dependence of the applied dc voltage. The polymer was poly (methylmethacrylate) doped with 5 wt\% disperse red 1 (DR1), and the measurements have been carried out at the telecommunication wavelength band around 1550 nm (optical C-band). The described measurements represent a new technique to determine the dispersion of the third-order susceptibility and molecular hyperpolarizability of the material filled into the slot of the ring-resonator.}, language = {en} } @article{BondarenkoVillringerSteglich2019, author = {Bondarenko, Siegfried and Villringer, Claus and Steglich, Patrick}, title = {Comparative Study of Nano-Slot Silicon Waveguides Covered by Dye Doped and Undoped Polymer Cladding}, series = {Applied Sciences}, volume = {9}, journal = {Applied Sciences}, number = {1}, publisher = {MDPI}, issn = {2076-3417}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-10716}, year = {2019}, abstract = {Nonlinear optical dyes doped in optical polymer matrices are widely used for electro-optical devices. Linear optical properties change with dye concentration, which leads to a change in modal properties, especially in nano-structured integrated waveguides such as silicon slot-waveguides. Here, we investigate the influence of a nonlinear optical dye on the performance of a silicon-organic hybrid slot-waveguide. A simulation study of the modal and optical confinement properties is carried out and dependence of the structural parameters of the slot-waveguide and the organic cladding material is taken into account. As cladding material, a guest-host polymer system is employed comprising the nonlinear optical dye Disperse Red 1 (DR1) doped in a poly[methyl methacrylate] (PMMA) matrix. The refractive indices of doped and undoped PMMA were deduced from ellipsometric data. We present a guideline for an optimized slot-waveguide design for the fabrication in silicon-on-insulator technology giving rise to scalable, high-performance integrated electro-optical modulators.}, language = {en} } @article{FursenkoLukosiusBaueretal.2019, author = {Fursenko, Oksana and Lukosius, Mindaugas and Bauer, Joachim and Villringer, Claus and Lux, Helge and B{\"a}rwolf, Florian and Lisker, Marco and Mai, Andreas}, title = {Diagnostic of graphene on Ge(100)/Si(100) in a 200 mm wafer Si technology environment by spectroscopic ellipsometry/reflectometry}, series = {Journal of Vacuum Science \& Technology B}, volume = {37}, journal = {Journal of Vacuum Science \& Technology B}, number = {6}, publisher = {American Vacuum Society (AVS)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-16083}, year = {2019}, abstract = {Comprehensive diagnostics is a prerequisite for the application of graphene in semiconductor technologies. Here, the authors present long-term investigations of graphene on 200-mm Ge(100)/Si(100) wafers under clean room environmental conditions. Diagnostic of graphene was performed by a fast and nondestructive metrology method based on the combination of spectroscopic ellipsometry and reflectometry (SE/R), realized within a wafer optical metrology tool. A robust procedure for unambiguous thickness monitoring of a multilayer film stack, including graphene, interface layer GeOx underneath graphene, and surface roughness is developed and applied for process control. The authors found a relationship between the quality of graphene and the growth of GeOx beneath graphene. Enhanced oxidation of Ge beneath graphene was registered as a long-term process. SE/R measurements were validated and complemented using atomic force microscopy, scanning electron microscopy, Raman spectroscopy, and secondary ion mass spectrometry. This comparative study shows a high potential for optical metrology of graphene deposited on Ge/Si structures, due to its great sensitivity, repeatability, and flexibility, realized in a nondestructive way.}, language = {en} } @inproceedings{VillringerGilaniZhangetal.2019, author = {Villringer, Claus and Gilani, Taravat Saeb and Zhang, Edward and Pulwer, Silvio and Steglich, Patrick and Schrader, Sigurd and Laufer, Jan}, title = {Development of tuneable Fabry-P{\´e}rot sensors for parallelised photoacoustic signal acquisition}, series = {Proc. SPIE 10878, Photons Plus Ultrasound: Imaging and Sensing 2019, 108780M (8 March 2019)}, booktitle = {Proc. SPIE 10878, Photons Plus Ultrasound: Imaging and Sensing 2019, 108780M (8 March 2019)}, publisher = {Society of Photo-Optical Instrumentation Engineers (SPIE)}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13769}, year = {2019}, abstract = {Fabry-P{\´e}rot (FP) sensors have enabled high resolution 3D photoacoustic (PA) imaging in backward mode. However, raster-scanning of the interrogation laser beam across the sensor can result in slow 3D image acquisition. To overcome this limitation, parallelized PA signal acquisition can be used for which FP sensors with uniform optical thickness are required. In this work, the optical thickness is tuned a) irreversibly through the use of a photopolymer host matrix and b) actively using embedded electro-optic (EO) chromophores. Polymer spacers (5 μm) were deposited using spin coating and sandwiched between two dielectric mirrors and transparent ITO electrodes. The employed polymer guest-host system consists of an EO chromophore (2-methyl-4-nitroaniline) and poly(vinyl cinnamate). EO tuneability was induced using contact poling and a tuneability of 68 pm was demonstrated. The optical thickness was homogenised by raster scanning a UV beam whilst varying the exposure time across a 4 mm2 detection aperture.}, language = {en} } @inproceedings{PohleBaumannPulweretal.2019, author = {Pohle, Ulrike and Baumann, Elisabeth and Pulwer, Silvio and Villringer, Claus and Zhang, Edward and Gerhardt, Holger and Laufer, Jan}, title = {Development of a backward-mode photoacoustic microscope using a Fabry-P{\´e}rot sensor}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15349}, pages = {594 -- 598}, year = {2019}, abstract = {Optical-resolution photoacoustic microscopy (PAM) has been shown to enable the acquisition of high resolution (μm) functional and anatomical images. For backward-mode operation, conventional piezoelectric ultrasound transducers need to be placed far away from the signal source due to their opacity and size. This can result in reduced acoustic sensitivity. Planar Fabry-Perot polymer film interferometer (FPI) sensors have the potential to overcome this limitation since they are transparent to the excitation wavelength, can be placed immediately adjacent to the signal source for high acoustic sensitivity, and offer a broadband frequency response (0 -50 MHz). In this study, we present a high frame rate, backward-mode OR-PAM system based on a planar FPI ultrasound sensor. A ns-pulsed laser provides excitation pulses (<200 nJ, maximum pulse repetition frequency = 200 kHz, 532 nm) to generate photoacoustic waves that are detected using a planar FPI sensor interrogated at 765-781 nm. For backwardmode operation and highest acoustic sensitivity, the excitation and interrogation beams are coaxially aligned and rasterscanned. The optical transfer function of the sensor, the spatial resolution and the detection sensitivity were determined to characterise the set-up. Images of a leaf phantom and first in vivo images of zebrafish larvae were acquired. This approach will enable fast 3D OR-PAM with high resolution and high sensitivity for functional and molecular imaging applications. FPI-based ultrasound detection also has the potential to enable dual-mode optical- and acousticresolution PAM and the integration of photoacoustic imaging with purely optical modalities such as multi-photon microscopy.}, language = {en} } @inproceedings{PulwerFiebelkornZeschetal.2019, author = {Pulwer, Silvio and Fiebelkorn, Richard and Zesch, Christoph and Steglich, Patrick and Villringer, Claus and Villasmunta, Francesco and Gedat, Egbert and Handrich, Jan and Schrader, Sigurd and Vandenhouten, Ralf}, title = {Endoscopic orientation by multimodal data fusion}, series = {Proc. SPIE 10931, MOEMS and Miniaturized Systems XVIII}, booktitle = {Proc. SPIE 10931, MOEMS and Miniaturized Systems XVIII}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-11420}, year = {2019}, abstract = {To improve the feasibility of endoscopic inspection processes we developed a system that provides online information about position, orientation and viewing direction of endoscopes, to support the analysis of endoscopic images and to ease the operational handling of the equipment. The setup is based on an industrial endoscope consisting of a camera, various MEMS and multimodal data fusion. The software contains algorithms for feature and geometric structure recognition as well as Kalman filters. To track the distal end of the endoscope and to generate 3D point cloud data in real time the optical and photometrical characteristics of the system are registered and the movement of the endoscope is reconstructed by using image processing techniques.}, language = {en} } @article{BauerFursenkoMarschmeyeretal.2019, author = {Bauer, Joachim and Fursenko, Oksana and Marschmeyer, Steffen and Heinrich, Friedhelm and Villasmunta, Francesco and Villringer, Claus and Zesch, Christoph and Schrader, Sigurd}, title = {Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process}, series = {Journal of Vacuum Science \& Technology B}, volume = {37}, journal = {Journal of Vacuum Science \& Technology B}, number = {6}, publisher = {American Vacuum Society (AVS)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-16093}, year = {2019}, abstract = {Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a high etch rate at a high aspect ratio, whereby scallops on the sidewalls are generated. In this work, square via arrays with dimensions from 3 to 50 μm and up to 300 μm depth were fabricated and analyzed by spectroscopic reflectometry. The reflectometric data are compared to simulations by a novel theoretical approach. In order to simulate the reflectance spectra of TSV arrays, a combination of 2D and 3D rigorous coupled wave analysis was applied. Besides the via depth, the sidewall angle and the corner radius of the bottom profile were considered in the model. The general requirements on spectral resolution in TSV metrology are discussed.}, language = {en} }