@article{LuxEdlingLuccietal.2019, author = {Lux, Helge and Edling, Matthias and Lucci, Massimiliano and Kitzmann, Julia and Villringer, Claus and Siemroth, Peter and De Matteis, Fabio and Schrader, Sigurd}, title = {The Role of Substrate Temperature and Magnetic Filtering for DLC by Cathodic Arc Evaporation}, series = {Coatings}, volume = {9}, journal = {Coatings}, number = {5}, issn = {2079-6412}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-12295}, pages = {345}, year = {2019}, abstract = {Diamond-like carbon (DLC) films were deposited using two different types of high current arc evaporation. The first process used a magnetic particle filter to remove droplets from the plasma. For the second process, the samples were put into a metallic cage which was placed directly above the plasma source. For both processes, we varied the substrate temperature from 21 to 350 °C in order to investigate the temperature effect. The samples were characterized using SEM, AFM, XPS, Raman Spectroscopy, Ellipsometry, Photometry, and Nano Indentation in order to compare both methods of deposition and provide a careful characterization of such DLC films. We found that the sp3 content and the hardness can be precisely adjusted by changing the substrate temperature. Furthermore, in the case of unfiltered deposition, the optical constants can be shifted in the direction of higher absorbance in order to produce black and hard carbon coatings.}, language = {en} } @article{SteglichVillringerDietzeletal.2019, author = {Steglich, Patrick and Villringer, Claus and Dietzel, Birgit and Mai, Christian and Schrader, Sigurd and Casalboni, Mauro and Mai, Andreas}, title = {On-Chip Dispersion Measurement of the Quadratic Electro-Optic Effect in Nonlinear Optical Polymers Using a Photonic Integrated Circuit Technology}, series = {IEEE Photonics Journal}, volume = {11}, journal = {IEEE Photonics Journal}, number = {3}, issn = {1943-0655}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-12307}, year = {2019}, abstract = {A novel method to determine the dispersion of the quadratic electro-optic effect in nonlinear optical materials by using a silicon-on-insulator microring resonator is presented. The microring consists of a silicon slot waveguide enabling large dc electric field strength at low applied voltages. The dispersion of third-order hyperpolarizability of a linear conjugated dye is approximated by using a two-level model for the off-resonant spectral region. As an example, the dispersion of the resonance wavelength of the resonator filled with a dye doped polymer was measured in dependence of the applied dc voltage. The polymer was poly (methylmethacrylate) doped with 5 wt\% disperse red 1 (DR1), and the measurements have been carried out at the telecommunication wavelength band around 1550 nm (optical C-band). The described measurements represent a new technique to determine the dispersion of the third-order susceptibility and molecular hyperpolarizability of the material filled into the slot of the ring-resonator.}, language = {en} } @inproceedings{SteglichVillringerDuemeckeetal.2015, author = {Steglich, Patrick and Villringer, Claus and D{\"u}mecke, Silvio and Padilla-Michel, Yazmin and Casalboni, Mauro and Schrader, Sigurd}, title = {Silicon-On-Insulator Slot-Waveguide Design Trade-Offs}, series = {Proceedings of the 3rd International Conference on Photonics, Optics and Laser Technology : vol. 2}, booktitle = {Proceedings of the 3rd International Conference on Photonics, Optics and Laser Technology : vol. 2}, publisher = {SciTePress}, address = {Set{\´u}bal}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-20104}, pages = {47 -- 52}, year = {2015}, abstract = {Silicon-on-insulator slot-waveguide structures are designed and analysed numerically. We present our theoretical investigation of field confinement factors and effective nonlinear areas for different waveguide structures in order to find optimized geometrical dimensions. It is shown that a slot-waveguide with a height of 220 nm, a slot width of 180 nm and a silicon rail width of 180 nm provides a five times higher field confinement in the cladding region compared to conventional strip-waveguides which explains the high sensitivity of slotwaveguide based label-free bio-sensors.}, language = {en} } @article{VillringerSteglichPulweretal.2021, author = {Villringer, Claus and Steglich, Patrick and Pulwer, Silvio and Schrader, Sigurd and Laufer, Jan}, title = {Electro-optical properties of doped polymers with high transparency in the visible wavelength range}, series = {Optical Materials Express}, volume = {11}, journal = {Optical Materials Express}, number = {11}, publisher = {Optica Publishing Group}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15480}, pages = {3801 -- 3811}, year = {2021}, abstract = {The electro-optical (EO) properties of poly(methyl methacrylate) and the photopolymer poly(vinyl cinnamate) doped with varying concentrations of the EO chromophore 2-Methyl-4-nitroaniline were measured. The EO polymers were embedded in Fabry-P{\´e}rot etalons for the simultaneous determination of the Pockels and Kerr coefficients from measurements of the fringe shift induced by an external electric field. It was found that the host polymer has a significant impact on the EO performance and that the undoped host polymers exhibit a significant Pockels effect. Moreover, the Kerr effect provides a substantial contribution of 27\% to the total change of the refractive index at relatively high electric field strengths of E = 91.2 MV m-1.}, language = {en} } @article{SopinskyyGrytsenkoVillringeretal.2023, author = {Sopinskyy, Mykola and Grytsenko, Kostyantyn and Villringer, Claus and Kolomzarov, Yurii and Schrader, Sigurd}, title = {Determination of scattering and Urbach absorption contributions to the light extinction in PTFE films by using graphical representation technique and numerical solution of the inverse problem}, series = {Semiconductor Physics, Quantum Electronics \& Optoelectronics}, volume = {26}, journal = {Semiconductor Physics, Quantum Electronics \& Optoelectronics}, number = {3}, publisher = {National Academy of Sciences of Ukraine. Institute for Semiconductor Physics}, address = {Kyiv}, issn = {1605-6582}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-18035}, pages = {303 -- 314}, year = {2023}, abstract = {Ellipsometrically obtained spectral dependences of ordinary αxy and extra-ordinary αz extinction/attenuation coefficients within the spectral range λ = 300…980 nm of uniaxially anisotropic polytetrafluoroethylene (PTFE) films were analyzed. We considered the capabilities and specific features of the graphical representation technique for determining the contribution of Rayleigh scattering and Urbach absorption to light attenuation in the spectral range beyond fundamental absorption. It has been shown that the graphical approach enables to estimate these contributions qualitatively, semi-quantitatively or quantitatively, depending on the situation. The conclusions made using the analysis of graphical representation are confirmed by numerical solution of the inverse problem via simulation of the αxy (λ), αz (λ) experimental dependences within the framework of a best-fit procedure. Being based on both of these approaches, we have ascertained that, in the as-prepared PTFE films, the so-called anomalous light scattering (ALS) with the spectral dependence of scattering coefficient αs ≈ as λ-p (p > 4) takes place. Transformation of scattering from ALS to the Rayleigh one with p ≈ 4 due to annealing is accompanied by an increase of Urbach (subband) absorption. Both of these factors cause narrowing the dynamic range of extinction coefficient values. Both scattering and absorption coefficients are higher for the component of light polarized along the normal to the substrate as compared to the component polarized in parallel to it. The relationship between observed behavior of the scattering and absorption coefficients and the film structure has been discussed.}, language = {en} } @article{GrytsenkoKolomzarovLytvynetal.2023, author = {Grytsenko, Kostyantyn and Kolomzarov, Yurii and Lytvyn, Peter and Kondratenko, Olga and Sopinskyy, Mykola and Lebedyeva, Iryna and Niemczyk, Agata and Baranowska, Jolanta and Moszyński, Dariusz and Villringer, Claus and Schrader, Sigurd}, title = {Optical and Mechanical Properties of Thin PTFE Films, Deposited from a Gas Phase}, series = {Macromolecular Materials and Engineering}, volume = {308}, journal = {Macromolecular Materials and Engineering}, number = {6}, publisher = {Wiley}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-17587}, year = {2023}, abstract = {Thin polytetrafluoroethylene (PTFE) films are produced by deposition from a gas phase by two methods: electron-enhanced vacuum deposition (EVD) and EVD + low-temperature plasma (LTP). Structure, morphology, and composition of the films are studied by IR spectroscopy, atomic force microscopy, and X-ray photoelectron spectroscopy. They are close to the structure of bulk PTFE. The roughness of the films' surface is changed with gas pressure and LTP power variations. Films are transparent from UV to near-infrared regions. Refractive and extinction indices and their anisotropy are measured by spectral ellipsometry. They are tuned by variations of deposition conditions. Hardness and Young modulus of the films are increased if EVD + low power LTP is used for film deposition. Use of EVD + LTP also increases thermal stability of the films. Contact angle of the films corresponds to the bulk PTFE. The PTFE molecules oriented are preferentially in perpendicular direction to the substrate surface.}, language = {en} } @inproceedings{SteglichMaiStolareketal.2016, author = {Steglich, Patrick and Mai, Christian and Stolarek, David and Lischke, Stefan and Kupijai, Sebastian and Villringer, Claus and Pulwer, Silvio and Heinrich, Friedhelm and Bauer, Joachim and Meister, Stefan and Knoll, Dieter and Casalboni, Mauro and Schrader, Sigurd}, title = {Partially slotted silicon ring resonator covered with electro-optical polymer}, series = {Proceedings of SPIE}, booktitle = {Proceedings of SPIE}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13771}, year = {2016}, abstract = {In this work, we present for the first time a partially slotted silicon ring resonator (PSRR) covered with an electro-optical polymer (Poly[(methyl methacrylate)-co-(Disperse Red 1 acrylate)]). The PSRR takes advantage of both a highly efficient vertical slot waveguide based phase shifter and a low loss strip waveguide in a single ring. The device is realized on 200 mm silicon-on-insulator wafers using 248 nm DUV lithography and covered with the electro-optic polymer in a post process. This silicon-organic hybrid ring resonator has a small footprint, high optical quality factor, and high DC device tunability. A quality factor of up to 105 and a DC device tunability of about 700 pm/V is experimentally demonstrated in the wavelength range of 1540 nm to 1590 nm. Further, we compare our results with state-of-the-art silicon-organic hybrid devices by determining the poling efficiency. It is demonstrated that the active PSRR is a promising candidate for efficient optical switches and tunable filters.}, language = {en} } @inproceedings{PulwerSteglichVillringeretal.2016, author = {Pulwer, Silvio and Steglich, Patrick and Villringer, Claus and Bauer, Joachim and Burger, Martin and Franz, M. and Grieshober, K. and Wirth, F. and Blondeau, J. and Rautenberg, J. and Mouti, S. and Schrader, Sigurd}, title = {Triangulation-based 3D surveying borescope}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15307}, pages = {51 -- 56}, year = {2016}, abstract = {In this work, a measurement concept based on triangulation was developed for borescopic 3D-surveying of surface defects. The integration of such measurement system into a borescope environment requires excellent space utilization. The triangulation angle, the projected pattern, the numerical apertures of the optical system, and the viewing angle were calculated using partial coherence imaging and geometric optical raytracing methods. Additionally, optical aberrations and defocus were considered by the integration of Zernike polynomial coefficients. The measurement system is able to measure objects with a size of 50 μm in all dimensions with an accuracy of ± 5 μm. To manage the issue of a low depth of field while using an optical high resolution system, a wavelength dependent aperture was integrated. Thereby, we are able to control depth of field and resolution of the optical system and can use the borescope in measurement mode with high resolution and low depth of field or in inspection mode with low resolution and higher depth of field. First measurements of a demonstrator system are in good agreement with our simulations.}, language = {en} } @inproceedings{PulwerJahnsVillringeretal.2020, author = {Pulwer, Silvio and Jahns, Daniel and Villringer, Claus and Schrader, Sigurd}, title = {Dynamic pattern generation by singlemode fibers for endoscopic 3D measurement systems}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15364}, year = {2020}, abstract = {This work presents experimental and simulation results of a 3D measurement concept based on fiber-optic interference pattern generation. A demonstrator system which is able to adjust different optical and mechanical parameters is described. The results of parameter variation studies are discussed along with possible applications in the field of micro-optical 3D measurement systems like endoscopes. The experiments were prepared with different structures with various scattering properties. To implement that approach into a micro-optical 3D measurement system, the combination of distance variation between the fibers and a controlled phase shift introduced by a retarder can be used to design the system versatile.}, language = {en} } @inproceedings{GilaniVillringerZhangetal.2018, author = {Gilani, Taravat Saeb and Villringer, Claus and Zhang, Edward and Gundlach, H. and Buchmann, Jens and Schrader, Sigurd and Laufer, Jan}, title = {Parallelised photoacoustic signal acquisition using a Fabry-Perot sensor and a camera-based interrogation scheme}, publisher = {SPIE}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-15335}, pages = {217 -- 222}, year = {2018}, abstract = {Tomographic photoacoustic (PA) images acquired using a Fabry-Perot (FP) based scanner offer high resolution and image fidelity but can result in long acquisition times due to the need for raster scanning. To reduce the acquisition times, a parallelised camera-based PA signal detection scheme is developed. The scheme is based on using a sCMOScamera and FPI sensors with high homogeneity of optical thickness. PA signals were acquired using the camera-based setup and the signal to noise ratio (SNR) was measured. A comparison of the SNR of PA signal detected using 1) a photodiode in a conventional raster scanning detection scheme and 2) a sCMOS camera in parallelised detection scheme is made. The results show that the parallelised interrogation scheme has the potential to provide high speed PA imaging.}, language = {en} } @inproceedings{VillringerGilaniZhangetal.2019, author = {Villringer, Claus and Gilani, Taravat Saeb and Zhang, Edward and Pulwer, Silvio and Steglich, Patrick and Schrader, Sigurd and Laufer, Jan}, title = {Development of tuneable Fabry-P{\´e}rot sensors for parallelised photoacoustic signal acquisition}, series = {Proc. SPIE 10878, Photons Plus Ultrasound: Imaging and Sensing 2019, 108780M (8 March 2019)}, booktitle = {Proc. SPIE 10878, Photons Plus Ultrasound: Imaging and Sensing 2019, 108780M (8 March 2019)}, publisher = {Society of Photo-Optical Instrumentation Engineers (SPIE)}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13769}, year = {2019}, abstract = {Fabry-P{\´e}rot (FP) sensors have enabled high resolution 3D photoacoustic (PA) imaging in backward mode. However, raster-scanning of the interrogation laser beam across the sensor can result in slow 3D image acquisition. To overcome this limitation, parallelized PA signal acquisition can be used for which FP sensors with uniform optical thickness are required. In this work, the optical thickness is tuned a) irreversibly through the use of a photopolymer host matrix and b) actively using embedded electro-optic (EO) chromophores. Polymer spacers (5 μm) were deposited using spin coating and sandwiched between two dielectric mirrors and transparent ITO electrodes. The employed polymer guest-host system consists of an EO chromophore (2-methyl-4-nitroaniline) and poly(vinyl cinnamate). EO tuneability was induced using contact poling and a tuneability of 68 pm was demonstrated. The optical thickness was homogenised by raster scanning a UV beam whilst varying the exposure time across a 4 mm2 detection aperture.}, language = {en} } @inproceedings{BauerHeinrichFursenkoetal.2017, author = {Bauer, Joachim and Heinrich, Friedhelm and Fursenko, Oksana and Marschmeyer, Steffen and Bluemich, Adrian and Pulwer, Silvio and Steglich, Patrick and Villringer, Claus and Mai, Andreas and Schrader, Sigurd}, title = {Very high aspect ratio through silicon via reflectometry}, series = {Proceedings of SPIE}, booktitle = {Proceedings of SPIE}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13758}, year = {2017}, abstract = {Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to 10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.}, language = {en} } @misc{SteglichVillringerPulweretal.2016, author = {Steglich, Patrick and Villringer, Claus and Pulwer, Silvio and Bauer, Joachim and Heinrich, Friedhelm and Casalboni, Mauro and Schrader, Sigurd}, title = {Advanced Nanophotonics: Silicon-Organic Hybrid Technology}, series = {Wissenschaftliche Beitr{\"a}ge 2016}, volume = {20}, journal = {Wissenschaftliche Beitr{\"a}ge 2016}, issn = {0949-8214}, doi = {10.15771/0949-8214_2016_1_6}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-5337}, pages = {45 -- 48}, year = {2016}, abstract = {Integrated photonic devices have gained increasing research interests. Especially silicon photonics have become very attractive for various optical applications. Using silicon-on-insulator as a material platform provides the ability to fabricate photonic devices with electronic devices on a single chip. Driven by substantial research investments, the integration of photonic devices on silicon-on-insulator substrates has reached a degree of maturity that already permits industrial adoption. However, silicon has the disadvantage of linear electro-optical effects, and, therefore, advanced modulation formats are difficult to realize when using silicon-based high-speed modulators. Hence, a new approach was proposed: the silicon-organic hybrid technology. This technology is a viable extension of the silicon-on-insulator material system for efficient high-speed modulation. We herewith present our theoretical and experimental investigations of the silicon-organic hybrid slot-waveguide ring resonator. The advanced device design is described in detail, which allows using both, the efficient silicon-on-insulator strip-waveguides and the silicon-organic hybrid slot-waveguides in single ring resonator. For the first time, we report the transmission spectra of such a resonator covered with an electro-optical polymer.}, language = {en} } @inproceedings{PulwerFiebelkornZeschetal.2019, author = {Pulwer, Silvio and Fiebelkorn, Richard and Zesch, Christoph and Steglich, Patrick and Villringer, Claus and Villasmunta, Francesco and Gedat, Egbert and Handrich, Jan and Schrader, Sigurd and Vandenhouten, Ralf}, title = {Endoscopic orientation by multimodal data fusion}, series = {Proc. SPIE 10931, MOEMS and Miniaturized Systems XVIII}, booktitle = {Proc. SPIE 10931, MOEMS and Miniaturized Systems XVIII}, issn = {1996-756X}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-11420}, year = {2019}, abstract = {To improve the feasibility of endoscopic inspection processes we developed a system that provides online information about position, orientation and viewing direction of endoscopes, to support the analysis of endoscopic images and to ease the operational handling of the equipment. The setup is based on an industrial endoscope consisting of a camera, various MEMS and multimodal data fusion. The software contains algorithms for feature and geometric structure recognition as well as Kalman filters. To track the distal end of the endoscope and to generate 3D point cloud data in real time the optical and photometrical characteristics of the system are registered and the movement of the endoscope is reconstructed by using image processing techniques.}, language = {en} } @article{SteglichMaiVillringeretal.2021, author = {Steglich, Patrick and Mai, Christian and Villringer, Claus and Dietzel, Birgit and Bondarenko, Siegfried and Ksianzou, Viachaslau and Villasmunta, Francesco and Zesch, Christoph and Pulwer, Silvio and Burger, Martin and Bauer, Joachim and Heinrich, Friedhelm and Schrader, Sigurd and Vitale, Francesco and De Matteis, Fabio and Prosposito, Paolo and Casalboni, Mauro and Mai, Andreas}, title = {Silicon-organic hybrid photonics: an overview of recent advances, electro-optical effects and CMOS integration concepts}, series = {Journal of Physics: Photonics}, volume = {3}, journal = {Journal of Physics: Photonics}, number = {2}, issn = {2515-7647}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-13882}, year = {2021}, abstract = {In recent decades, much research effort has been invested in the development of photonic integrated circuits, and silicon-on-insulator technology has been established as a reliable platform for highly scalable silicon-based electro-optical modulators. However, the performance of such devices is restricted by the inherent material properties of silicon. An approach to overcoming these deficiencies is to integrate organic materials with exceptionally high optical nonlinearities into a silicon-on-insulator photonic platform. Silicon-organic hybrid photonics has been shown to overcome the drawbacks of silicon-based modulators in terms of operating speed, bandwidth, and energy consumption. This work reviews recent advances in silicon-organic hybrid photonics and covers the latest improvements to single components and device concepts. Special emphasis is given to the in-device performance of novel electro-optical polymers and the use of different electro-optical effects, such as the linear and quadratic electro-optical effect, as well as the electric-field-induced linear electro-optical effect. Finally, the inherent challenges of implementing non-linear optical polymers on a silicon photonic platform are discussed and a perspective for future directions is given.}, language = {en} } @inproceedings{VillasmuntaSteglichVillringeretal.2024, author = {Villasmunta, Francesco and Steglich, Patrick and Villringer, Claus and Schrader, Sigurd and Schenk, Harald and Mai, Andreas and Regehly, Martin}, title = {Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections}, series = {Optical Interconnects XXIV}, volume = {12892}, booktitle = {Optical Interconnects XXIV}, editor = {Chen, Ray T. and Schr{\"o}der, Henning}, publisher = {Society of Photo-Optical Instrumentation Engineers (SPIE)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-19759}, year = {2024}, abstract = {In the context of an ever-growing volume of data generated by established and emerging technologies, such as 5G, the Internet of Things, artificial intelligence, machine learning, blockchain, and virtual reality, faster communication speed is demanded by data centers and high-performance computing. Transceiver requirements surged from 100 to 400 Gb/s and beyond. In this scenario, photonics aims to enable Tb/s optical communication at energies below 1 pJ/bit. Targeting higher communication rates while maintaining a low power budget can significantly benefit from 3D photonic chip architectures. This paper presents the simulation-based design, fabrication, and characterization of a monolithically integrated optical through-silicon waveguide that facilitates the connection between different surfaces of a silicon chip. Deep reactive ion etching was employed in both the Bosch and Cryogenic variants to evaluate the effect of sidewall roughness on propagation losses. The mechanical stability of the waveguide was ensured by interrupting the annular trench with a bridging structure. The high-refractive-index contrast to air provides tight light confinement for a core size of up to 50 μm and multimode operation at 1550 nm. The morphology was characterized using scanning electron microscopy (SEM), and optical transmission characterization was performed using relative power loss measurements. A tunable laser source was buttcoupled to a waveguide to analyze light transmission efficiency. Preliminary measurements using single-mode fiber show that the transmitted values exceeded 99\% for all structures.}, language = {en} } @article{BauerFursenkoMarschmeyeretal.2019, author = {Bauer, Joachim and Fursenko, Oksana and Marschmeyer, Steffen and Heinrich, Friedhelm and Villasmunta, Francesco and Villringer, Claus and Zesch, Christoph and Schrader, Sigurd}, title = {Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process}, series = {Journal of Vacuum Science \& Technology B}, volume = {37}, journal = {Journal of Vacuum Science \& Technology B}, number = {6}, publisher = {American Vacuum Society (AVS)}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-16093}, year = {2019}, abstract = {Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a high etch rate at a high aspect ratio, whereby scallops on the sidewalls are generated. In this work, square via arrays with dimensions from 3 to 50 μm and up to 300 μm depth were fabricated and analyzed by spectroscopic reflectometry. The reflectometric data are compared to simulations by a novel theoretical approach. In order to simulate the reflectance spectra of TSV arrays, a combination of 2D and 3D rigorous coupled wave analysis was applied. Besides the via depth, the sidewall angle and the corner radius of the bottom profile were considered in the model. The general requirements on spectral resolution in TSV metrology are discussed.}, language = {en} } @misc{SteglichVillringerPulweretal.2017, author = {Steglich, Patrick and Villringer, Claus and Pulwer, Silvio and Dietzel, Birgit and Ksianzou, Viachaslau and Schrader, Sigurd}, title = {Chip-integrierte photonische Bauelemente}, series = {Wissenschaftliche Beitr{\"a}ge 2017}, volume = {21}, journal = {Wissenschaftliche Beitr{\"a}ge 2017}, issn = {0949-8214}, doi = {10.15771/0949-8214_2017_7}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-9426}, pages = {55 -- 59}, year = {2017}, abstract = {In unserer hochtechnologisierten Gesellschaft spielt die optische Daten{\"u}bertragung aufgrund der stetig wachsenden Informationsvielfalt eine immer bedeutendere Rolle. In den Anf{\"a}ngen der Nachrichtentechnik waren Datenraten von wenigen bit/s realisierbar. Heute werden mittels optischer Technologien {\"U}bertragungsraten von mehreren Gbit/s umgesetzt. M{\"o}glich wird dies durch neue Entwicklungen in der Chip-integrierten Photonik. Beispiele daf{\"u}r sind Chip-integrierte elektrooptische Modulatoren und Schalter. In diesem Artikel werden neue Entwicklungen in der Chip-integrierten Photonik diskutiert und die experimentelle Charakterisierung der Bauelemente in Form eines Ringresonators beschrieben. F{\"u}r die Experimente wird exemplarisch ein photonisches Bauelement genutzt, das aus einem hybriden Silizium-Polymer-Materialsystem besteht. Die Ergebnisse zeigen, dass diese Materialkombination vielversprechend f{\"u}r zuk{\"u}nftige Chip-integrierte photonische Bauelemente mit extrem geringem Energiebedarf ist.}, language = {de} } @misc{SteglichKsianzouVillringeretal.2018, author = {Steglich, Patrick and Ksianzou, Viachaslau and Villringer, Claus and Pulwer, Silvio and Schrader, Sigurd}, title = {Theorie der Modenlinienspektroskopie zur optischen Charakterisierung von Polymerschichten}, series = {Wissenschaftliche Beitr{\"a}ge 2018}, volume = {22}, journal = {Wissenschaftliche Beitr{\"a}ge 2018}, issn = {0949-8214}, doi = {10.15771/0949-8214_2018_4}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-10248}, pages = {31 -- 38}, year = {2018}, abstract = {Die Modenlinienspektroskopie kann zur hochpr{\"a}zisen Charakterisierung von Polymerschichten bez{\"u}glich des Brechungsindex verwendet werden. Das vorliegende Manuskript behandelt die Theorie der Modenlinienspektroskopie und beginnt dabei mit den theoretischen Grundlagen eines planaren Wellenleiters, die zum Verst{\"a}ndnis der Modenlinienspektroskopie notwendig sind. Die hier pr{\"a}sentierten expliziten Herleitungen k{\"o}nnen genutzt werden, um die Modenlinienspektroskopie so zu modifizieren, dass auch die Messung des Pockelseffektes m{\"o}glich ist. Eine Anwendungsm{\"o}glichkeit soll in der zuk{\"u}nftigen Bestimmung des Pockelskoeffizienten bestehen, der f{\"u}r die Weiterentwicklung von polymerbasierten elektrooptischen Modulatoren ben{\"o}tigt wird. Zudem werden der Aufbau und die experimentelle Herangehensweisen beschrieben und die Brechungsindexbestimmung wird exemplarisch am Beispiel einer Wirt-Gast-Polymerschicht demonstriert.}, language = {de} } @article{SteglichMaiVillringeretal.2018, author = {Steglich, Patrick and Mai, Christian and Villringer, Claus and Pulwer, Silvio and Casalboni, Mauro and Schrader, Sigurd and Mai, Andreas}, title = {Quadratic electro-optic effect in silicon-organic hybrid slot-waveguides}, series = {Optics Letters}, volume = {43}, journal = {Optics Letters}, number = {15}, issn = {1539-4794}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:526-opus4-12148}, year = {2018}, abstract = {This Letter reports on the quadratic electro-optic effect of polymers, observed in a silicon slot-waveguide at low voltages. We demonstrate that in narrow slots, the electro-optic response with respect to refractive index change is strong enough for on-chip wavelength tuning and intensity modulation using voltages as low as 1 V. A silicon slot-waveguide embedded by a nonlinear optical polymer, consisting of the dye Disperse Red 1 in poly(methyl methacrylate), serves as the phase shifter in a racetrack ring resonator. As deduced from the experimental data, the third-order susceptibility of the utilized electro-optic polymer is about 2·10-19 m2/V2. The demonstrated low-voltage operation and inherently thermal stability show the potential for silicon-organic hybrid devices using the quadratic electro-optic effect.}, language = {en} }