TY - JOUR A1 - Steglich, Patrick A1 - Bondarenko, Siegfried A1 - Mai, Christian A1 - Paul, Martin A1 - Weller, Michael G. A1 - Mai, Andreas T1 - CMOS-Compatible Silicon Photonic Sensor for Refractive Index Sensing Using Local Back-Side Release TI - IEEE Photonics Technology Letters N2 - Silicon photonic sensors are promising candidates for lab-on-a-chip solutions with versatile applications and scalable production prospects using complementary metal-oxide semiconductor (CMOS) fabrication methods. However, the widespread use has been hindered because the sensing area adjoins optical and electrical components making packaging and sensor handling challenging. In this work, a local back-side release of the photonic sensor is employed, enabling a separation of the sensing area from the rest of the chip. This approach allows preserving the compatibility of photonic integrated circuits in the front-end of line and metal interconnects in the back-end of line. The sensor is based on a micro-ring resonator and is fabricated on wafer-level using a CMOS technology. We revealed a ring resonator sensitivity for homogeneous sensing of 106 nm/RIU. Y1 - 2020 UR - https://opus4.kobv.de/opus4-th-wildau/frontdoor/index/index/docId/1364 UR - https://nbn-resolving.org/urn:nbn:de:kobv:526-opus4-13649 SN - 1941-0174 VL - 32 IS - 19 SP - 1241 EP - 1244 ER -