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In this paper, we describe a new Java framework for an easy and efficient way of developing new GUI based speech processing applications. Standard components are provided to display the speech signal, the power plot, and the spectrogram. Furthermore, a component to create a new transcription and to display and manipulate an existing transcription is provided, as well as a component to display and manually correct external pitch values. These Swing components can be easily embedded into own Java programs. They can be synchronized to display the same region of the speech file. The object-oriented design provides base classes for rapid development of own components.
We present the fluorescence excitation and dispersed emission spectra of the parent compound of the boron dipyrromethene (BODIPY) dye class measured in a supersonic beam and isolated in superfluid helium nanodroplets. The gas‐phase spectrum of the isolated molecules displays many low‐frequency transitions that are assigned to a symmetry‐breaking mode with a strongly nonharmonic potential, presumably the out‐of‐plane wagging mode of the BF2 group. The data are in good agreement with transition energies and Franck–Condon factors calculated for a double minimum potential in the upper electronic state. The corresponding transitions do not appear in the helium droplet. This is explained with the quasi‐rigid first layer of helium atoms attached to the dopant molecule by van der Waals forces. The spectral characteristics are those of a cyanine dye rather than that of an aromatic chromophore.
Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
Topic coverage includes:
Failure Analysis Process Flow
Failure Verification
Failure Modes and Failure Classification
Special Devices (MEMS, Optoelectronics, Passives)
Fault Localization Techniques: Package Level (NDT)
Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
Deprocessing & Imaging Techniques: Deprocessing
General Imaging Techniques
Local Deprocessing & Imaging
Circuit Edit and Design Modification
Material Analysis Techniques
Reference Information: Important Topics for Semiconductor Devices
Failure Analysis Techniques Roadmap
Failure Analysis Operations and Management
Appendices: Failure Analysis Terms, Definitions, and Acronyms
Industry Standards
Innovative Leistungsmodule
(2011)
Versorger und Verlierer
(2011)