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Der Beitrag zeigt im Prinzip und an konkreten Beispielen auf, dass Anforderungen an Bauprodukte selten pauschal und einheitlich für Bauwerke bestehen, sondern in der großen Mehrheit aller Fälle für jede konkrete Verwendungssituation in einem spezifischen Bauwerk im Rahmen des Planungsprozesses entstehen. Häufig kann die gleiche Bauwerksanforderung mit verschiedenen Lösungswegen erreicht werden, die jeweils unterschiedliche Anforderungen an die verwendeten Bauprodukte bedeuten.
Der Beitrag gibt einen Überblick über die verschiedenen Abweichungen, die im Bauordnungsrecht behandelt werden. Die Abweichungen von den materiellen Anforderungen des Bauordnungsrechtes werden nur kurz behandelt. Abweichungen bei den Nachweisen für Bauprodukte und Bauarten werden ausführlich diskutiert hinsichtlich möglicher Ursachen und den Auswirkungen für die Nachweisführung. Auch auf das Thema "Abweichungen" bei Bauprodukten mit CE-Kennzeichnung nach BauPVO wird eingegangen. Die Abweichungen bei Technischen Baubestimmungen für Planung, Bemessung und Ausführung werden mit Bezug auf die VV TB erläutert.
Circular hollow sections of beech-laminated veneer lumber (LVL) for the use as temporary geotechnical soil nailing systems are currently being developed. Due to their permanent subsoil cement embedment, investigations of the bond line quality of the timber sections are essential. This paper presents the bonding properties of flat and curved beech LVL after cyclic conditioning in a water–cement grout solution aimed at inducing short- and long-term alkaline attack of the timber. In total, 409 and 69 samples were tested in tensile shear tests after short-term and long-term conditioning, respectively.
Three different adhesive systems, a one-component polyurethane adhesive, a melamine–urea–formaldehyde adhesive and a melamine–urea–formaldehyde adhesive modified by means of (polyvinyl)-acetate adhesive were investigated and compared. Short-term conditioning by submersion in boiling cement suspension was found to be a reliable method for testing the bonding performance rather than long-term conditioning. In the case of tensile shear tests of samples subjected to long-term treatment, wood material strength was the decisive criterion. Generally, tensile shear test samples of all investigated adhesives achieved reliable bonding for a pressing force up to 1.0 MPa. No relationship was recognised between the determined bonding failure and the wood properties tensile shear strength, wood failure percentage, fracture pattern and bulk density of veneers adjacent to the bond line.
For the determination of the bond line integrity of curved veneer poles, it was necessary to test bonding quality in a combined test using curved and flat samples and to compare tensile shear strength with data determined on reference samples in the same veneer population without bond line.
Innovative circular, hollow, laminated veneer lumber (LVL) beech sections for use as temporary geotechnical soil reinforcement members are currently being developed. Appropriate surface gluing quality between the veneers is fundamental to this subsoil application of the permanently cement-embedded, engineered timber product. The circular cross-section geometry and the permanently high-alkaline environment of the structural member is not covered by presently standardized testing and conditioning methods for examining LVL surface bond line quality. The sample conditioning and tensile shear test method compliant with EN 302-1 (Adhesives for load-bearing timber structures—test methods—part 1: determination of longitudinal tensile shear strength, European Committee for Standardization, Brussels, 2013) was modified to determine bonding parameters for circular, hollow LVL sections. Bond line curvature, groove cutting depth and sample geometry were found to greatly influence stress distribution, percentage of wood failure and tensile shear strength.
Short-term alkaline treatment of test samples did not significantly influence the bonding performance, wood failure percentage, tensile shear strength and fracture patterns. To improve tensile shear strength, adhesives with different material rigidities were used and compared. An orthotropic, elastic numerical analysis revealed a greater influence of adherent elasticity than adhesive elasticity on the stress distribution within the bond line. With regard to determining the bond line integrity of curved veneer poles, a sample geometry compliant with EN 302-1 (2013) was developed and numerically evaluated.
Alles dicht?
(2006)
Environmental scanning electron microscopy (ESEM) and complementary methods were employed to study the time dependent film formation of a latex dispersion in water and cement pore solution. First, a model carboxylated styrene/n-butyl acrylate latex dispersion possessing a minimum film forming temperature (MFFT) of 18 °C was synthesized in aqueous media via emulsion polymerization. Its film forming property was at a temperature of 40 °C, studied under an ESEM. The analysis revealed that upon removal of water, film formation occurs as a result of particle packing, particle deformation and finally particle coalescence. Film formation is significantly retarded when the latex dispersion is present in cement pore solution. This effect can be ascribed to adsorption of Ca2+ ions onto the surface of the anionic latex particles and to interfacial secondary phases. This layer of adsorbed Ca2+ ions hinders interdiffusion of the macromolecules and subsequent film formation of the latex polymer.
Both the subthreshold slope and the threshold voltage in inverted-staggered amorphous silicon thin-film transistors (a-Si:H TFTs) are vulnerable to metastable changes in the density of states (DOS) due to Fermi level displacement. In previous work, we have used passivated and unpassivated TFTs to distinguish between the effects of bulk states and interface states at the top passivating nitride interface. Here we report the results of experimental measurements and two-dimensional (2-D) simulations on unpassivated TFTs. Since there are no top interface states, all the observed changes are due solely to the bulk DOS. The subthreshold current activation energies in a-Si:H TFTs are compared for n-channel nonpassivated TFTs before and after bias stress. The experimental results agree well with the 2-D simulations, confirming that the dependence of subthreshold current activation energy on gate bias reveals the distribution of the DOS in energy but cannot resolve the magnitude of features in the DOS. This type of analysis is not accurate for TFTs with a top passivating nitride, since the activation energies in such devices are affected by the interfere states.