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Institute
Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
Topic coverage includes:
Failure Analysis Process Flow
Failure Verification
Failure Modes and Failure Classification
Special Devices (MEMS, Optoelectronics, Passives)
Fault Localization Techniques: Package Level (NDT)
Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
Deprocessing & Imaging Techniques: Deprocessing
General Imaging Techniques
Local Deprocessing & Imaging
Circuit Edit and Design Modification
Material Analysis Techniques
Reference Information: Important Topics for Semiconductor Devices
Failure Analysis Techniques Roadmap
Failure Analysis Operations and Management
Appendices: Failure Analysis Terms, Definitions, and Acronyms
Industry Standards