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The variation of the contact impedance of adhesive conductive EMI shielding tapes under high temperature storage (HTS) of 110degC is investigated. The adhesive tapes under test are implemented as signal return paths in microstrip lines. Changes in the ground plane impedance by adhesive deterioration are analyzed by S-parameter measurements from 1MHz to 3GHz. A circuit model for contact impedance degradation is proposed and applied in simulation of board level shielding. Contact resistance and contact capacitance are found to increase significantly after 2400h, causing a declined magnetic field shielding effectiveness by 30 dB below 500 MHz.
We introduce a quick and accurate quasi-static magnetic field scanning technique by employing a progressive sampling method in an unconfined input space. The proposed
machine learning algorithm is tested against uniform sampling on a printed circuit board test structure. We prove allocation of multiple, separated regions with predefined tangential field strengths at MHz frequencies. The feasibility of equivalent magnetic dipole source modeling based on a small number of samples is demonstrated. Compared to uniform testing, progressive expansion sampling detects contours of given field limits in less than 3% of the reference measurement time.