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Institute
Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.
Topic coverage includes:
Failure Analysis Process Flow
Failure Verification
Failure Modes and Failure Classification
Special Devices (MEMS, Optoelectronics, Passives)
Fault Localization Techniques: Package Level (NDT)
Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
Deprocessing & Imaging Techniques: Deprocessing
General Imaging Techniques
Local Deprocessing & Imaging
Circuit Edit and Design Modification
Material Analysis Techniques
Reference Information: Important Topics for Semiconductor Devices
Failure Analysis Techniques Roadmap
Failure Analysis Operations and Management
Appendices: Failure Analysis Terms, Definitions, and Acronyms
Industry Standards
The System HAILsens implements a device for Real-Time sensor data processing, running on a Texas Instruments Concerto M3 core. An I2C interface is used for sensor communications. Ethernet with UDP on a custom developed three layered frame organisation of sensor data serves as a link to the main system on board of an aeroplane. For backing up the acquired data, all frames are locally stored on an SD Card. To have the possibility of easily checking the current system status, an LCD module and a push-button provide a minimal user interface.
Texas Instruments' MSP430 Launch Pad is used as a key component for remote labs that complement an introduction course to microcomputer technology in the bachelor program Mechatronic at the University of Applied Sciences in Rosenheim. The remote labs use breakout boards and include a timer experiment with generation of pulse width modulation signals, I2C communication and analog to digital conversion.
A DDR2 DRAM test setup is developed and implemented on the Griffin III ATE test system from HILEVEL Technologies. The test system provides a raw platform for performing various mixed signal and digital tests. In order to configure patterns easily in a vector format, a software platform is developed to manage test patterns according to the user's analysis needs. As examples, retention test patterns with disabled self-refresh are applied to 2 Gbit DDR2 SDRAM of two different DRAM vendors. The devices are characterized in respect to their intrinsic leakage and data retention behavior under the influence of stress conditions such as temperature or access algorithm. The tests are automated and test data is logged for an off-line data analysis. Data is recorded before and after solder simulation steps in order to observe a retention time degradation.
Reference design projects are implemented to the Xilinx Zynq on the Zedboard which is extended by user defined electronic hardware connected through the Zedboard's FMC (FPGA Mezzanine Card) connector. The implementation method with HDL Workflow Advisor includes constraint definitions for modified reference design projects for use with digital input and outputs and Zynq's XADC (Analog-Digital converter) which is characterized and compared to its data sheet. The bandwidth of the Zynq's internal AXI (Advanced eXtensible Interface) bus connected to the Simulink host PC is determined.
A DDR2 SDRAM test setup implemented on the Griffin III ATE test system from HILEVEL Technologies is used to analyse the row hammer bug. Row hammer pattern experiments are compared to standard retention tests.
The analysis confirms that the row hammer effect is caused by a charge excitation process depending on the number of stress activation cycles. The stress has to occur in the local neighborhood of the cells under test.
Shallow impurity levels support the responsible charge carrier transport process in the used DDR2 SDRAM technology