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Institute
Validation and calibration of Electrothermal Device Models Using Infrared Laser Probing Techniques
(1998)
Reliability analysis of power MOSFET’s with the help of compact models and circuit simulation
(2002)
Built-in EMC in der Aufbau- und Verbindungstechnik am Beispiel des integrierten Startergenerators
(2002)
A compact and high-reliable converter design for an Integrated Starter Generator is presented. The concept is based on integration of the power switches with both the cooling system and the DC link capacitor, which optimizes the thermal management and minimizes inductive and conductive losses. The materials and joining technologies are selected in such a way that the converter can be operated up to 125 C ambient temperature. Therefore, the water cooling system of the combustion engine can directly be used. The paper further reports on circuit simulation results verifying the converter design and on first electrical measurements obtained on a functional prototype operating under normal load conditions (6kW rated power).
High temperature reliability on automotive power modules verified by power cycling tests up to 150°C
(2003)
The automotive industry is pushing power electronic packaging to higher operating and heatsink temperatures while still requiring very high power densities due to limited space. Currently, the power electronics that is implemented within the engine compartment of the vehicle must operate with heatsink temperatures of approximately 85/spl deg/C and this temperature can be expected to increase to 125/spl deg/C in the near future. The high temperature operation of the power electronic structure is fundamentally limited by the employed materials maximum temperatures. A packaging concept is introduced that describes a structure realisation that enables the materials to operate at high ambient temperatures without exceeding their individual maximum temperatures. This in turn allows the complete power electronic structure to operate at a higher system temperature. In this paper, the packaging concept that can be used to meet these difficult requirements of high temperature and high power-density is introduced, discussed and implemented. Two case studies are considered and implemented to illustrate the packaging concept.