A study of heel crack failures in wire bonds under mechanical cycling
| Author: | Norbert SeligerORCID, S. Ramminger, T. Franke, G. Wachutka |
|---|---|
| Parent Title (English): | Proceedings of Micromat 2000 |
| Document Type: | Conference Publication |
| Language: | English |
| Publication Year: | 2000 |
| Release Date: | 2023/06/15 |
| Tag: | heel crack; reliability; wire bond |
| Peer reviewed: | Nein |
| faculties / departments: | Fakultät für Ingenieurwissenschaften |
| Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 60 Technik / 600 Technik, Technologie |
