Reliability model for Al wire bonds subjected to heel crack failures
| Author: | S. Ramminger, Norbert SeligerORCID, G. Wachutka |
|---|---|
| DOI: | https://doi.org/10.1016/S0026-2714(00)00139-6 |
| ISSN: | 0026-2714 |
| Parent Title (German): | Microelectronics Reliability |
| Document Type: | Article (peer reviewed) |
| Language: | English |
| Publication Year: | 2000 |
| Release Date: | 2023/06/09 |
| Volume: | 40 |
| Issue: | 8 |
| Page Number: | 5 |
| First Page: | 1521 |
| Last Page: | 1525 |
| faculties / departments: | Fakultät für Ingenieurwissenschaften |
