High temperature reliability on automotive power modules verified by power cycling tests up to 150°C
| Author: | G. Coquery, G. Lefranc, T. Licht, R. Lallemand, Norbert SeligerORCID, H. Berg |
|---|---|
| DOI: | https://doi.org/10.1016/S0026-2714(03)00318-4 |
| ISSN: | 0026-2714 |
| Parent Title (German): | Microelectronics Reliability |
| Document Type: | Article (peer reviewed) |
| Language: | English |
| Publication Year: | 2003 |
| Release Date: | 2023/06/09 |
| Volume: | 43 |
| Issue: | 9 |
| Page Number: | 6 |
| First Page: | 1871 |
| Last Page: | 1876 |
| faculties / departments: | Fakultät für Ingenieurwissenschaften |
