Planar Interconnect Technology for Power Module System Integration
- The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLIT®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production.
Metadaten| Author: | Karl Weidner, Michael Kaspar, Norbert SeligerORCID |
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| Parent Title (English): | 7th International Conference on Integrated Power Electronics Systems (CIPS) |
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| Publisher: | VDE-VERLAG GMBH |
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| Document Type: | Conference Publication |
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| Language: | English |
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| Publication Year: | 2012 |
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| Release Date: | 2021/11/22 |
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| Tag: | SiPLIT; innovative package; planar interconnect technology; power cycling capability; power module system integration; power semiconductor devices; reliability |
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| Page Number: | 5 |
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| First Page: | 13.1 |
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| faculties / departments: | Fakultät für Ingenieurwissenschaften |
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