DRAM Failure Analysis and Defect Localization Techniques, Microelectronics Failure Analysis

  • Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.  Topic coverage includes:  Failure Analysis Process Flow Failure Verification  Failure Modes and Failure Classification  Special Devices (MEMS, Optoelectronics, Passives)  Fault Localization Techniques: Package Level (NDT)  Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)  Deprocessing & Imaging Techniques: Deprocessing  General Imaging Techniques  Local Deprocessing & Imaging  Circuit Edit and Design Modification  Material Analysis Techniques  Reference Information: Important Topics for Semiconductor Devices  Failure Analysis Techniques Roadmap  Failure Analysis Operations and Management  Appendices: Failure Analysis Terms, Definitions, and Acronyms  Industry Standards

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Metadaten
Author:Martin Versen
Parent Title (English):Desk Reference Sixth Edition
Publisher:ASM International
Place of publication:Ohio
Document Type:Part of a Book
Language:English
Publication Year:2011
Tag:DRAM Failure Analysis; Microelectronics
faculties / departments:Fakultät für Ingenieurwissenschaften
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten