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High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

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Author:G. Coquery, G. Lefranc, T. Licht, R. Lallemand, Norbert SeligerORCiD, H. Berg
DOI:https://doi.org/10.1016/S0026-2714(03)00318-4
ISSN:0026-2714
Parent Title (German):Microelectronics Reliability
Document Type:Article (peer reviewed)
Language:English
Publication Year:2003
Volume:43
Issue:9
Page Number:6
First Page:1871
Last Page:1876
faculties / departments:Fakultät für Ingenieurwissenschaften