• search hit 1 of 1
Back to Result List

Planar Interconnect Technology for Power Module System Integration

  • The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLIT®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production.
Metadaten
Author:Karl Weidner, Michael Kaspar, Norbert SeligerORCiD
Parent Title (English):7th International Conference on Integrated Power Electronics Systems (CIPS)
Publisher:VDE-VERLAG GMBH
Document Type:Conference Proceeding
Language:English
Publication Year:2012
Tag:SiPLIT; innovative package; planar interconnect technology; power cycling capability; power module system integration; power semiconductor devices; reliability
Page Number:5
First Page:13.1
faculties / departments:Fakultät für Ingenieurwissenschaften