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A high-frequency performance and degradation study of adhesive conductive EMI shielding tapes during High-Temperature Storage

  • The variation of the contact impedance of adhesive conductive EMI shielding tapes under high temperature storage (HTS) of 110degC is investigated. The adhesive tapes under test are implemented as signal return paths in microstrip lines. Changes in the ground plane impedance by adhesive deterioration are analyzed by S-parameter measurements from 1MHz to 3GHz. A circuit model for contact impedance degradation is proposed and applied in simulation of board level shielding. Contact resistance and contact capacitance are found to increase significantly after 2400h, causing a declined magnetic field shielding effectiveness by 30 dB below 500 MHz.

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Metadaten
Author:Norbert SeligerORCiD, Cordula Helmbrecht
ISBN:978-3-8007-6288-0
ISSN:0341-3934
Parent Title (English):Proccedings CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
Publisher:VDE VERLAG GMBH
Place of publication:Düsseldorf
Document Type:Conference Proceeding
Language:English
Publication Year:2024
Tag:EMI; High-Temperature Storage; Shielding tape; adhesive conductive EMI shielding tape
Page Number:7
First Page:297
Last Page:303
Peer reviewed:Ja
faculties / departments:Fakultät für Ingenieurwissenschaften
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 60 Technik / 600 Technik, Technologie